Circuits Assembly Online Magazine - New Products

New Products

CHO-SEAL 6502 and 6503 EMI gasket materials were developed for high-performance in adverse environments common to aerospace, automotive and telecommunication applications. Are Ni-plated aluminum particle-filled silicone and fluorosilicone elastomers. Offer shielding after exposure to high and low humidity and temperature cycles, as well as salt/fog environments. Come in molded and extruded product forms, as well as a silicone, thermally cured, robotically dispensed and a form-in-place version: CHO-FORM 5560. Filler technology performs when used against aluminum flanges with either MIL-C-5541 trivalent or hexavalent, Class 1A or Class 3 chromate conversion treatment. NiAl particles reduce aluminum flange galvanic corrosion activity by factor of two.

Chomerics, www.chomerics.com

MicroLine 1000 S depaneler features a UV laser beam for cutting along components or circuit paths, reportedly without mechanical or thermal interference. Is toolless, allowing any contour. Is programmable via included software or via the CAD software. Compact footprint.

LPKF, www.lpkf.de

Stamped Circuit Board thermal management draws heat away from beneath the chip quickly. Combines structured layers of metal and plastic for use in substrate assemblies. Is based on a reel-to-reel concept and offers possibilities to automate production. Possible solutions: with versatile stamping, materials can be inflected and stamped; the resulting shape stabilizes the substrate and fixates the lenses; open choice of many different materials and thicknesses; simpler operation, and quicker separation.

Heraeus, www.wc-heraeus.de

S2088BO-II automatic optical wirebond inspection desktop system is available. Was developed to inspect medium and small product runs, delivering defect detection on die, ball-wedge, wedge-wedge and security bonds. Reportedly guarantees reliable defect detection to cover typical bonds. During inspection, a high-res camera records all bond sites and wires. Inspects aluminum thick wire and aluminum, or gold thin wire connections, down to diameters of 17 μm. Inspection library includes inspection patterns for damaged and misplaced components. Is 100 % compatible with all Viscom inline systems; can be employed as a programming station.

Viscom, www.viscom.com

PV-7010 potting agent is a fast room temperature or heat cure, as well as a thick section cure. Requires no solvents or cure byproducts. Is a translucent, tough dielectric gel with minimal shrinkage for protecting electronic devices in solar applications. Is used for coating, encapsulating or potting; seals and protects in applications requiring stronger adhesion or improved dimensional stability. Has a working time of 10 min. Is a 1:1, two-part silicone potting material used for junction box components. Is available in cartridges, pails and drums.

Dow Corning Solar Solutions, www.dowcorning.com/solar
Krayden Inc., www.krayden.com

Tridak Model 475 diaphragm valves are designed to be used with low-to-medium viscosity fluids. Internal design prevents fluid contact with actuating components; reportedly ideal for reactive fluids such as cyanoacrylates and solvent-based adhesives and coatings. Minimal valve maintenance is required. Offer stroke adjustment. Are available in three configurations: Standard Model 475 features an UHMW polyethylene diaphragm, acetyl copolymer fluid body, and hard-coated aluminum air cylinder body; Model 475-T valve features a Teflon diaphragm and fluid body with a hard-coated aluminum air cylinder body; Model 475-SA valve incorporates an UHMW polyethylene diaphragm, passivated stainless steel fluid body, and hard-coated aluminum air cylinder body.

Tridak, www.tridak.com