The Worldwide IC Packaging Market, 2010 Edition offers an in-depth look at the worldwide integrated circuit packaging market. Provides forecasts of individual IC device markets, for units, revenue and ASP from 2008 through 2014. Forecasts package solutions for each of these markets, broken into I/O ranges. An overall worldwide forecast of IC packages, divided into 12 different package families, plus bare die solutions, is also provided.

Major package families include:

• Dual in-line package (DIP)

• Small outline transistor (SOT)

• Small outline (SO)

• Thin small outline package (TSOP)

• Dual flat pack no lead (DFN)

• Chip carrier (CC)

• Quad flat pack (QFP)

• Quad flat pack no lead (QFN)

• Pin grid array (PGA)

• Ball grid array (BGA)

• Fine-pitched ball grid array (FBGA)

• Wafer-level package (WLP)

Unit forecasts for die mounted using direct chip attach methods are offered. CA methods include chip on board (COB), flip chip on board (FCOB), chip on glass (COG), flip chip on glass (FCOG), and tape automated bonding (TAB)/tape carrier package (TCP).

Packaging revenue is generated by multiplying worldwide units with pricing information supplied by the contractor IC package assemblers.

Supplies contract IC packaging market forecast, with units and revenue analyzed by package family. Forecasts are computed by compiling information obtained from each individual contract assembly company. Pricing information is provided by I/O count and price per I/O, and when multiplied by units, yields revenue. Profiles of individual contract IC package assemblers are also provided, as is commentary on the state of the industry.

New Venture Research, www.newventureresearch.com

MX500 fully-modularized AOI, for inspecting solder and lead defects, presence and position, correct part, and polarity for inspection down to 01005 components, is scalable and flexible. Uses a multi-lane approach, featuring a horizontal-stackable conveyor system with a primary master inspection lane that can be coupled with additional lanes to support dual-lane, triple-lane and full-fledged quad-lane configurations. Includes novel inspection sensors for speed and flexibility.

CyberOptics, www.cyberoptics.com

Cone-shaped XS filters are for Panasonic CM402 and CM602 nozzles. Come in packs of 100 and are designed for 100-series, 100S-series, 200-series, 200S-series, 400-series and 1000-series nozzles. Are compatible with Panasonic replacement nozzles for high-speed (8- and 12-nozzle, Type A-0 and A-2) and multifunctional (Type B) placement heads. Function properly with the following Panasonic/KME pick-and-place machines: CM20F, CM301-D, CM301-DU, CM301-DS, DT401, DT401-M, DT401-F, DT400-M, CM401-M, CM401-L, CM402-M, CM402-L, CM400-M, CM212-M, CM232, CM201-D, CM202-D, CM201-DU, CM202-DU, CM201-DH, CM202-DH, CM202-DHU, CM201-DS, CM202-DS, CM202-DK and CM602-L.

Count On Tools Inc., www.cotinc.com

Redesigned Siemens ceramic replacement nozzles offer placement down to 01005 components. Are compatible with Siplace, CS, CF, D1, D2, D3, D4 F5, HM, HS-60, HF, S-27, HM, X2, X3, X4, X4i and SX. Have special vacuum geometry and are ESD-safe. Bodies machined from high-strength plastic. Reportedly will not crack or break under normal working conditions. Come individually or in six-packs in 901, 902, 904, 906 and 925 versions.

Count On Tools Inc., www.cotinc.com