Trident OneShot automatic defluxing and cleanliness testing system is designed to provide automatic cleaning (de-fluxing), cleanliness testing, and drying of post-reflow circuit assemblies. Includes a 16" touch-screen interface, shadow-reducing focus-wash technology, unlimited recipe quantities, Windows PC control platform, networking capabilities, and real-time cleanliness testing. Features optional barcode scanning and SQL database searches. Is capable of removing all flux/paste residues (rosin, no-clean, water-soluble) from any alloy, and is designed to use a selection of pre-dosed defluxing chemistries. Boards are cleaned, cleanliness tested, and dried in less than 30 min.

Aqueous Technologies Corp., www.aqueoustech.com

Reflow Oven Cleaner is a micro-emulsion for cleaning reflow ovens and wave solder machines. Is a non-flammable, low toxicity, odor solvent designed to remove all types of flux residues; can prevent buildup of condensed flux residues. Can be used at temperatures between 20° C and 50 °C, with an optimum working temperature of 40°C. Can switch the oven on immediately after use.  Contains inhibitors to prevent corrosion to ferrous and non-ferrous metals; is compatible with most plastics.

Electrolube, www.electrolube.com

UCM3070 boundary scan plug-on module is for the Agilent utility card of Medalist i3070 Series 5 in-circuit tester. Combine Agilent’s in-circuit test with Goepel boundary scan test in one machine.  Is generated with System Cascon software. Can be fitted on the utility card, which communicates with the host system via USB and is based on Scanbooster architecture for test clock of up to 16 MHz. The validated plug-on card enables boundary scan test with two test access ports (TAPs 1.8 V to 4.5 V), eight parallel interface ports for faster flash programming and optional analogue channels. Includes self-test of the device in hardware package.

Agilent Technologies, www.agilent.com
Goepel Electronic, www.goepel.com

4-mm ITF3 feeder is for A-Series pick-and-place machines. Reportedly improves reliability of 01005 component placement. Accepts W4P1 all-plastic tape standardized by the IEC; tape eliminates paper dust that can cause bad solder connections to the micro-miniature components. Is static-free. Helps cut waste by 75% compared with traditional 8-mm tapes on a 2-mm pitch.

Assembléon, www.assembleon.com