Sarcon 100GR-HL thermal interface material is an advanced gap filler pad manufactured with a hardened top surface. Consistently adheres to the target electrical component or opposing heat sink. Can remove without tearing or damaging the material during assembly and rework. Transfers heat with a thermal conductivity of 2.8 W/m°K and a thermal resistance of .44°Cin2/W at 72.5 PSI. This 1.0 mm thick, flame retardant TIM comes in sheets up to 300 x 200 mm.

Fujipoly America Corp., www.fujipoly.com

XF-603 is a 0.0001" white polyimide, halogen-free label material designed to meet the VTM-0 level of flame retardants per UL94. Has significant self-extinguishing performance. When combined with a high-temperature resistant polyimide film, is said to prevent flame propagation. Is coated with a high-opacity gloss white topcoat designed for flexo-graphic and thermal transfer printing. When matched with proper inks or thermal ribbon, it reportedly withstands high temperatures, harsh chemicals and solvents. Complies with RoHS, REACH, and is certified to be halogen-free to IEC 61249-2-21.

Polyonics, www.polyonics.com

OE-8001 die attach adhesive is a one-part heat curable methyl silicone resin adhesive for LED manufacturing. Reportedly offers better adhesion strength than conventional silicone DA and better thermal stability than conventional epoxy DA. Is formulated for good pin transfer.

Dow Corning, www.dowcorning.com

LS60V-LED automated SMT pick-and-place machine handles longer LED panel lengths and LED package nozzle dimensions and material selection. Uses touchless centering system, providing placement rates of up to 4,800 cph. Handles panels up to 800 mm. Comes with an array of nozzles for common LED packages. Custom nozzles available. Is capable of placing 0201s, SOICs, 0.0015" pitch QFPs and CSPs, BGAs, and µBGAs. 

APS Novastar, www.apsgold.com