Automated Optical Inspection (AOI) Report is an analysis of AOI offerings including price/performance benchmarks, supplier perception ratings and a direct comparison of 44 performance metrics for 27 unique models offered by 11 different AOI suppliers. Examines market dynamics for solder paste and PCB inspection. Analysis includes end-user inspection requirements, served and not served prerequisites and emerging technologies. AOI suppliers described in the report include ASC International, Agilent, Christopher Associates, CyberOptics, DJK Global, Goepel, GSI Lumonics, Koh Young, Landrex, Malcomtech, Marantz, Mirtec, MVP, Omron, Opto Control, Orbotech, Panasonic, Qualectron, Saki, Seika, Sony, Viscom, ViTechnology and YesTech. 50 pp.

ITM Marketing, www.itmconsulting.org

S3X58-M650 solder paste is an ICT testable, halogen-free SAC 305 alloy. Properties include low voiding, high print speeds, and fine-pitch (µBGA, 0.4 mm pitch) capability.
 
S3X70-M407 Pb-free no-clean solder paste for ultra-fine-pitch applications uses a Type 5 powder; has been formulated for 0.2 mm pitch (µBGA) devices and 01005 components. Is said to wet in air environments and is low voiding.
 
Koki Co. Ltd., www.ko-ki.co.jp

 

GoWave 1030 wave soldering system is for low-volume production for both leaded and Pb-free applications. Is for soldering small- or medium-sizes batches. Now features a longer reflection tunnel over both the preheat area and the solder pot. Has been redesigned as one unit. Features a new spray flux nozzle with HVLP technology. Has a PCS 707 touchscreen controller and USB interface. Service points for the fluxer and compressed air are now located directly at the inlet section of the machine. Features a new switch cabinet and updated pump motor, as well as a redesigned exhaust area and conveyor.

Seho Systems, www.sehona.com

SMT spring-loaded connectors are offered as discrete contacts; many are available in tape-and-reel packaging. Part family 0910-0 and 0910-1 through 4 are discrete SLCs specifically designed for production tape-and-reel assembly. Part 0967 is a horizontal mount SMT SLC designed for low-profile board-to-board interconnections. Feature a large base for either increased PCB stability or assembly in non-PCB applications such as a face plate. Part family 0990-0 and 0990-1 through 4 and 0997-0 through 9 offer a range of application heights from 0.137" to 0.430".
   
Mill-Max, www.mill-max.com