Multicore LF730 Pb-free solder paste uses DAP Plus Type 4 solder powder and a flux medium said to permit greater process latitude. Reportedly prints thorough apertures as small as 160 µm, permitting more solder per aperture with less risk of aperture clogging. Volume release is said to be over 90%. 

Wets to a range of surface finishes, and can be used in environments from 30°C at 84% RH. Features open and abandon times of two to three hours, standard refrigeration storage, six-month shelf life and good hot slump resistance.

Henkel, www.henkel.com/electronics

IM-6000 series provides high-precision dimension inspection. Pattern registration and search functions provide place-and-press measurement operation. Reportedly eliminates need for optical comparators, x-y stages for part positioning, CNC measuring devices, and measuring and stereo microscopes. Parts to be measured are placed on the IM’s sample tray, and the measurement button pressed. An iPASS automatically locates, identifies and measures parts placed anywhere within the unit’s 100 mm field of view. A part evaluation library stores the images, measurement functions and specifications of parts, and provides automatic pattern search, part recognition and measurement without setup the next time inspection of the same parts is performed. Performs up to 99 distinct measurements with the press of a button. High-precision image acquisition and sub-pixel processing permit measurement of hard-to-inspect features.

Keyence Corp. of America, www.keyence.com

Siplace SiCluster Professional software determines component overlaps in family setups. Groups shared components on constant component tables, which remain on the machine during setup changeovers. Reportedly reduce setup time by hours, while reducing space and investment requirements for feeders and component carts by up to 33%. Is available as an add-on to Siplace Pro v. 7.1, which offers setups for single products or product families combined with fixed setups, offline setups of feeder tables and changeover tables concepts, nonstop setup changeovers with line execution system, or random setups of individual feeder modules.

Siemens Electronics Assembly Systems, www.siplace.com

 

The EWS-310 wave soldering machine has continuous PCB width adjustment; accommodates boards up to 12" or 310 mm in width. Reportedly provides the same level of process control and parameter monitoring found in more expensive machines. Total power consumption is at least 10% less than comparable models. Employs a durable "L" finger handling mechanism. Has on-board LCD touch screen with graphic user interface. 

APS Novastar, www.apsgold.com