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New Products

The dual-head MC-385 pick-and-place system has IPC-9805 speed of up to 5,500 cph, plus expandability and compatibility features. Is for high-mix, mid-volume assembly. Uses Cognex flying vision and stationary bottom vision. Chip placement capability includes 0201s and flip chips, while AC motor and linear encoder combined with vision, ensure a placement accuracy of ±0.03 mm (±0.001"). Accommodates 64 smart tape feeders; up to 128 feeders are installable in the batch mode. Features high-precision ball-screw X-Y drive and closed-loop servo control with linear encoding.

Manncorp, www.manncorp.com/pick-and-place/mc385

The Model 780 spool valve reportedly provides a higher rate of fluid flow during dispensing. Is designed to accommodate a broader range of fluids, including those possessing high viscosities. Can be integrated into robotics and automated production processes. Has adjustable material suck-back and flow control. Is supplied with hard-coated aluminum components and Teflon seals, and is also available in stainless steel and Teflon construction.
 
Tridak, www.tridak.com

 

The point-and-shoot Mobile Hawk handheld imager is said to read any 2-D barcode, including direct part marks. Combines MAXlite machine vision illumination with X-Mode DPM algorithms. MAXlite leverages NERLITE experience in machine vision lighting with an integrated multi-axis lighting solution; delivers a plug-and-play mobile imager that is easy to use and reliable for low-contrast DPM applications. USB powered. Features a blue line targeting pattern for quick symbol location and easy barcode output into standard databases.
 
Microscan, www.microscan.com

 

iCure spot curing system is an inline fiber-optic system that provides heat by IR radiation in a portable unit, delivering accurate control for temperature-sensitive substrates and complex devices. Is made for automated manufacturing processes requiring adhesive curing and localized heating of bonded assemblies. Has a 200 W lamp with up to 90 W/cm2. Batch processes can be fully automated by attaching the flexible lightguide to a robotic arm. Applications include spot curing thermal epoxies; bonding and fixing plastic and glass components; fixing lenses; temporary fixing of miniature components; precision assembly and bonding of semiconductor components; focused energy for micro soldering, and localized heat welding of thermoplastics. 

IRphotonics, www.icure-irphotonics.com

 

OvenChecker thermal profiler verifies that ovens remain in spec after a board’s initial “characterization” profile. Is designed to be self-contained, and requires no thermocouples or repeated use of golden boards. Reportedly can be taught to an operator in less than two minutes. Comes in a kit that includes a three-sensor pallet, V-M.O.L.E. thermal profiler with M.A.P. software, and a thermal barrier.

Is said to perform over 1,000 runs without degradation.

ECD, www.ecd.com/products/ovenchecker

 

 

RP-113178 Pick-and-Place Underfilm enhances CSP and BGA solder joint reliability. Air or nitrogen reflow compatible. Requires no prebaking of boards. Is reportedly 100% reworkable and RoHS-compatible. Is said to reduce solder joint fatigue failures, and requires no additional cure cycle. Implement into design and manufacturing process by utilizing existing SMT Line and existing tape and reel feeders. Comes in standard EIA-481 carrier tape.
 
Alltemated Inc., www.alltemated.com
 

 

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