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New Products

OvenChecker thermal profiler verifies that ovens remain in spec after a board’s initial “characterization” profile. Is designed to be self-contained, and requires no thermocouples or repeated use of golden boards. Reportedly can be taught to an operator in less than two minutes. Comes in a kit that includes a three-sensor pallet, V-M.O.L.E. thermal profiler with M.A.P. software, and a thermal barrier.

Is said to perform over 1,000 runs without degradation.

ECD, www.ecd.com/products/ovenchecker

 

 

RP-113178 Pick-and-Place Underfilm enhances CSP and BGA solder joint reliability. Air or nitrogen reflow compatible. Requires no prebaking of boards. Is reportedly 100% reworkable and RoHS-compatible. Is said to reduce solder joint fatigue failures, and requires no additional cure cycle. Implement into design and manufacturing process by utilizing existing SMT Line and existing tape and reel feeders. Comes in standard EIA-481 carrier tape.
 
Alltemated Inc., www.alltemated.com
 

 

Stacked Die Tool software performs acoustic imaging to identify anomalies and defects in stacked die configurations. Can image all of the interfaces in a stack of eight die. Can sort out the correct echoes and provide acoustic imaging accuracy.
 
Sonoscan, www.sonoscan.com

 

VHX-600 Generation II digital microscope now features 16-bit imaging resolution. The brightness range has been increased from 256 levels to 65,536 levels. 3CCD color clarity has improved from 16 million to more than 2.8 trillion colors. Has high dynamic range function; graphic engine creates images in 16-bit gradation through the acquisition of RGB data from each pixel. The double'r automatic lens/zoom recognition system makes it possible for the VHX to recognize in real time which lens is mounted to the camera, and also the current magnification being viewed. Calibration is automatically adjusted when magnification is changed. Reportedly offers a depth-of-field at least 20x greater than conventional microscopes. Includes a pixel-shift actuator, achieving observation with resolution of up to 54 million pixels. Uses a flicker-free progressive scan method. Has a wide selection of high-resolution RZ optical design zoom lenses, with up to 5000x magnification.
 
Keyence Corp. of America, www.keyence.com

 

Alpha Nickel laser-cut nickel stencils are designed to provide 0.001" and 0.0005" stencil thicknesses for aperture printing, hard nickel for wear resistance, and positional and size accuracy. Features include flatness and low internal stress; custom thicknesses; mirror smooth board side finish; high repeatability and accuracy; fine-pitch printing (for print applications down to 0.4 mm pitch).
 
Cookson Electronics, www.cooksonelectronics.com
 

 

Heat-Spring metallic thermal interface material is a soft metal alloy developed as a compressible metallic shim for Infineon PrimePACK IGBT mounting applications. Reportedly reduces thermal resistance below that of other TIMs. Consists of soft metal preforms that are compressible. Does not contain silicone; does not outgas, and does not exhibit pump-out. Is stable and requires no special mounting apparatus. Is conductive thermally and electrically. Made of 100% recyclable and reclaimable metal.

Indium Corp., www.indium.com


 

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