IP-500 multifunctional tabletop platform for automated processes comes with a dispenser with an open application area for combined 2-D and 3-D applications. Application-specific robot heads use one or multiple Z-axes, Z- and theta-axes combinations. Dispense or high-speed spindle heads can be added. Exchanged needles are calibrated in X, Y and Z. With the integrated visual control, the dispensing area can be inspected immediately after dispensing of the media. CAD data import for point, matrix, line, curve or individual dispense patterns is possible; the X, Y and Z-axis are synchronized, and the dispense path is controlled and optimized continuously.
Zevac AG, www.zevac.ch
Atlas Cartridge Filling System is for adhesives, lubricants and other assembly fluids. Facilitates bottom-filling 2.5- to 32-oz. cartridges with consistent amounts of 2000 to 750K cps material. Is said to eliminate rework and product loss from filling cartridges with too much material. Features a compact, lightweight design that permits moving to different locations as needed; facilitates rapid product changeovers. Is easy to clean.
EFD, www.efd-inc.com
FeederMaster is the second-generation model of the multi-platform feeder test jig Feedermaster Digital. Automatically detects deviations of the feeder pick-position and records the test results. New feeder generations, including Fuji NXT, are supported.
AdoptSMT, www.AdoptSMT.com
SMTrue Run Optimize offline programming and management software module is for use with LS, LE, and CS SMT pick-and-place machines. Incorporates universal CAD translator with offline job and feeder setup, programming, optimization, and management. Converts industry standard, text delimited CAD files into a machine friendly component, location, and orientation database.
APS Novastar, www.apsgold.com
Alpha JP-500 is a Pb-free no-clean solder paste developed for use in the Mydata MY-500 jet printer. Is zero-halogen and -halide material, with a wide reflow profile window for good solderability on various board/component finishes. Reportedly has good and flux cosmetics after reflow soldering. Reduces random solder balling levels, and can be used for single- or double-reflow. Meets IPC-7095 Class III voiding performance. Does not require nitrogen.
Cookson Electronics, www.cooksonelectronics.com