New Products
Galaxy Thin Wafer System offers process capability of Cp>2 @ +/-12.5 µm. A wafer pallet secures wafers as thin as 75 µm during transport and processing. Is approximately 400 mm2; is flat to less than 10 µm; can accommodate wafers as large as 300 mm. Can be held securely while being processed DirEKt Ball Placement, DirEKt Coat wafer backside coating, protective coating imaging, thermal interface materials deposition, wafer bumping and encapsulation. DirEKt Coat process for deposition of 25 µm thick die attach adhesives and other coatings now has process capability of Cp>2 @ +/-12.5 µm and a total thickness variation of 7 µm on 150 µm wafers up to 200 mm in diameter. Said to be capable of first-pass yield ball placement of 200 µm spheres at 3000 µm pitch, thermal interface materials deposition and wafer bumping.
DEK, www.dek.com
Kaleido high-resolution color head enhances definition at the repair station; enabling decisions based on the defect picture. Inspects solder joint and lead defects. With i-lite technology, a color-enhancement solution at the defect viewer station is offered; can see 01005 components, as well as associated solder joint. RGB lighting structure enables rendering of color picture.
Vi Technology, www.vitechnology.com
EP30BN is a two-part boron nitride epoxy adhesive; is a medium-viscosity epoxy with good flow characteristics for bonding, sealing and potting. Is designed to optimize heat dissipation, and cures at room temperature. Mechanical strength properties and chemical resistance are maintained over the temperature range of -60° to 300°F. Has volume resistivity in excess of 1014 ohm cm and thermal conductivity of 24 btu/hr/ft2/°F/in.
Master Bond, www.masterbond.com
Multicore TFN700B is a no-clean, halide-free tacky flux formulated specifically for package-on-package applications. Is a Newtonian-based system; reportedly eliminates shearing conditions associated with traditional tacky flux formulations. Enables optical recognition of flux by pick-and-place systems; permits visual verification of volume before placement of the top component of the PoP. Is suitable for doctor blading and dip transfer for PoP builds. Is ROLO-classified, or non-hydroscopic and non-corrosive.
Henkel Corp., www.henkel.com/electronics
Spectrum thermal process optimization software is said to automatically identify the correct furnace setup for a thermal profile within the sweet spot of the established process window. Uses information from a single profile pass to evaluate millions of possible furnace setups. Each possible furnace recipe will yield a profile, and the Spectrum identifies the fit between the profile and the established process window. Within seconds, reportedly can complete an exhaustive ranking and present its recommendation for the furnace recipe (zone temperatures and conveyor speed). Is a software-only option for the SunKIC profiler.
KIC, www.kicthermal.com
e-Clipse is said to be fast and convenient to attach, and provides repeatable profile readings. Features four spring-loaded thermocouples within a lightweight fixture that also holds the solar wafer. TCs have disk-shaped beads, rather than the traditional spherical shaped beads, for reliable contact to the solar wafer surface. Permits quick replacement of broken wafers. Four standard type K TC connectors plug into the profiler.
KIC, kicthermal.com
Press Releases
- SIA Applauds CHIPS Act Incentives for GlobalWafers Projects in Texas and Missouri
- ROCKA Solutions Continues Expansion in Brazil with New Location in Manaus
- Juki America Announces New Regional Sales Manager for the Southwest Territory
- WittcoSales Welcomes New Team Member to Enhance Customer Experience and Service