Hirox's MX-BGAZ II Lens is said to perform easy, accurate BGA exterior observation. Allows ball joints to be observed nondestructively. Has 3-D optical rotary ring, including prism tip with lighting and a cushion mechanism to ensure comfortable observation. Helps specify such problems as overheating, oxidation and air foam formation. Inspects upper and lower ball joints Is capable of up to 180X magnification. Features spring-loaded lens tip to protect samples, and configurable and flexible lineup of lenses and peripheral devices.

Hirox/Seika Machinery, Inc., www.seikausa.com

XE-1000 series robotic soldering systems are for attaching tabbing and bus ribbon to crystalline silicon, amorphous silicon, CIGS and CdTe solar cells. Automate soldering process. Programmable control reportedly permits repeatable soldering over a wide range of format sizes. Can be used for either SnPb or Pb-free applications.

Christopher Associates Inc., www.christopherweb.com

Double/Bubble epoxy, urethane and silicone adhesives are available in variety-pak cartons of 25 or 50, in addition to the traditional 100-size carton. Color-coded, dual-pouch adhesive formulations include eight epoxies, three urethanes, and a silicone. Are designed to meet the needs of small to medium-size organizations for in-house or field service applications. Includes an adhesive selector guide. Includes five-minute epoxy, a non-sag gel epoxy for vertical and overhead use. Urethanes include a high-peel strength and high-shear strength. A silicone adhesive/sealant and a “one-wash” scrubbing beadlet hand cleanser are part of the full product offering. 

Sanford Distributing Company Inc., www.TheEpoxysource.com

 

BPWin 5.0 software platform has intellectual property protection, featuring BPWin job protection. Enables viewing and editing only with password, and permits full control of programming parameters. Additional features include COM serialization – external serialization server and a free serialization software development kit; process monitoring and control features automation control and supports SPC, verification, auditing and logging; process monitoring permits customer-defined functionality. Has software version control with BPWinLauncher. Device programming features a NAND management utility and data pattern compression. Has JobMaster integrity check, enhanced buffer utilities and an image format tool.

BPM Microsystems, www.bpmmicro.com