FlashCORE III programming architecture is said to offer significant performance gains by increasing the download and read/write speeds by a factor of ten. Supports flash memory devices including SD, MMC, MoviNAND and iNAND. Is compatible with all existing FlashCORE algorithms and adapters; field upgrade kits are available for existing automated system installations.

Data I/O, www.dataio.com 

Model 765 needle valve is suited for non-reactive adhesives, silicone oils, inks, and solvents. Can be used in processes such as device assembly, packaging, optics assembly, and building PCBs. Offers low maintenance and precision flow control. Is integratable into process automation and robotics. Optimal operation is achieved by using the Model 345 valve controller for valve actuation.
 
Tridak, www.tridak.com

The AT-GDP series BGA rework station has automated device removal and installation processes. Handles SnPb and Pb-free applications consisting of components such as BGAs, CSPs, QFNs, flip chips, and other SMDs. Enables placement to within 5 µm. Split Vision Optics permits simultaneous top of the PCB/bottom of the component viewing. Creates diagonal corner viewing for alignment of larger packages at high magnification. Absence of mirrors in the optics system reportedly ensures a clear image quality. Software contains a database of predefined profiles, which can be modified. Program settings can be adjusted while profile is running. Software controls reflow via forced air, nitrogen convection top heater, and large-area Quartz IR preheater.

Advanced Techniques US Inc., www.atco-us.com

IPC-2152, Standard for Determining Current-Carrying Capacity in Printed Board Design, is for determining the appropriate sizes of internal and external conductors as a function of the current-carrying capacity required and acceptable conductor temperature rise. Replaces IPC-2221 conductor sizing charts. Provides guidance on how thermal conductivity, vias, power dissipation, printed board material and thickness, and the presence of copper planes factor into the relationship between current, conductor size, and temperature. Establishes general guidelines for sizing conductors and contains simple charts that show testing results for both internal and external conductors in air and vacuum environments. Appendix explains how variables impact the temperature rise of a conductor, and presents charts based on copper weights. 97 pages.

IPC, www.ipc.org/onlinestore