XPii comes with one or two placement heads, 8 or 12 nozzles, tape or feeder trolleys, a matrix tray sequencer and an internal matrix tray. Features linear motors, high resolution digital cameras, turret head(s) and intelligent feeders. On-head optical sensors detect presence of components as small as 01005 and as large as 50 x 50 mm on-the-fly. Handles components up to 70 x 70 mm and 100 mm connectors with fixed camera option. Accommodate components on tape, strip tape, stick and matrix tray. Gantry platform has a 40 position "smart: nozzle bank (2 x 40) or (1 x 40 + 1 x 20 + 1 special) optional. Reportedly places at rates up to 13,500 cph (11,340 cph based on IPC-9850), or 15,000 cph (12,800 cph IPC-9850) with Tornado head

Europlacer, www.europlacer.com

CPJ+ reduces process variability to maintain a constant Takt time by ensuring consistent flow rates for applications such as underfill with tight keep-out zones, and sealing applications. With Fluidmove software, integral electro-pneumatic regulators, and precision weigh scale, CPJ+ is said to automatically compensate for both fluid viscosity changes over time as well as batch-to-batch variations. Reportedly increases dispense accuracy for higher yields and ensures a highly repeatable process, minimizing setup-to-setup and line-to-line variation, while eliminating operator interaction.

Asymtek, www.asymtek.com

ER2218 epoxy resin is a two-part encapsulation compound designed to meet UL94 flame retardency. Incorporates a novel flame retardant, resulting in an low viscosity flame retardant formulation. Is RoHS-compliant and non-halogenated and free of aromatic amines. Adheres to a variety of substrates, exhibits resistance to water and a variety of chemicals. Is reflow compatible. Comes in resin packs for air-free mixing of small volumes. Bulk product and resin kits will also be available for larger volumes.

Electrolube, www.electrolube.com

VP4000 4-channel vapor phase temperature profiler has a low mass, hermetically sealed RF data-logger with heat-shield, measuring 130 x 60 x 40 mm. Is capable of passing directly through the preheat, vapor reflow and vacuum stages. Profile data are continuously passed to a PC via two-way wireless RF link. Profile can be viewed in real time as boards are being soldered.
 
AutoSeeker automatic reflow process optimization software reportedly eliminates trial-and-error approach. Given a user profile, it uses a rules-based algorithm to search for the best machine settings. User criteria such as process window centered, fastest throughput or lowest running costs can be defined.
 
Solderstar Pro RF wave and reflow profiling is for reflow and wave solder temperature profiling. This scalable system permits reflow profiling on 6, 9, 12 or 16 channels. When used in conjunction with the Waveshuttle wave solder process analyzer, it forms a wave analysis tool capable of detailed wave temperature profile and wave contact measurements. Incorporates an ultra-compact RF data-logger that provides a two-way RF data link with a PC. Permits system setup, process improvements and data downloads to be performed efficiently and temperature profile to be analyzed in real time.
 
SolderStar Ltd., www.solderstar.eu