MCP screen printer has a head design with variable attack angle printing that reportedly permits constant solder pressure independent of stencil thickness. Single-head system reportedly reduces maintenance by half. Board cycle time is as low as 11 sec. Reduces defect per million figures by up to 50%. Has a flat-metal single-head squeegee. Variable angle print head improves repeatability of paste deposition for 01005 components. Produces solder shapes with stencil thickness down to 50 µm, and half-edging stencils with stencil steps of 30 to 50 µm. Is ideal for PCBs mixing 01005 (0.4 mm x 0.2 mm) types with larger component sizes.
 
Assembléon, www.assembleon.com

 

DCA-FD is a modified silicone conformal coating said to dry to the touch in 20 min. Increased solids content reportedly gives 35% greater coverage per liter compared to standard DCA. Has a wide operating temperature range and is suitable for a range of commercial and high-rel applications. Has lower VOC levels compared to standard DCA. Has excellent adhesion and is resistant to most solvents, lubricants and chemicals. Is highly resistant to mold growth and UV light. Can be sprayed, dipped or brushed. Is RoHs-compliant and meets UL746CQMJU2, DEF-STAN 59/47(4), and IPC-CC-830.
 
Electrolube, www.electrolube.com 

GTO graphical user interface helps rework and assembly technicians locate single or multiple components on a PCB. Produces a unified PCB image by combining top and bottom Gerber silkscreens, pick-and-place drill files, and formatted BoM (.csv file). Creates a composite view of PCB by fusing silkscreens, parts list, and placement information into a single view, allowing locating an individual component or a group of BoM line-item components. Generates assembly notes, and automatically generates symbol/color coded assembly prints, showing exactly which parts need to be located in certain locations on the PCB. Stored project bundle creates a single file containing top and bottom silkscreen, pick-and-place, BoM, and notes to be distributed to engineering or customers.

Saelig Co., www.saelig.com

XT V 130 x-ray inspection system is compact and comes with a 30-130 kV open micro-focus x-ray source, 4-axis programmable manipulator and 16-bit imaging system based on a 4” image intensifier. Reports compliant with MRP systems. Focal spot size down to 3 microns, 320X geometric magnification and tilt angle up to 60°. Rotate stage and CT capability optional. Hinged door provides access to inspection area, which fits samples up to 40 x 35 cm (16 x 14”).

Nikon Metrology, www.nikonmetrology.com