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New Products

EP30BN is a two-part boron nitride epoxy adhesive; is a medium-viscosity epoxy with good flow characteristics for bonding, sealing and potting. Is designed to optimize heat dissipation, and cures at room temperature. Mechanical strength properties and chemical resistance are maintained over the temperature range of -60° to 300°F. Has volume resistivity in excess of 1014 ohm cm and thermal conductivity of 24 btu/hr/ft2/°F/in.
 
Master Bond, www.masterbond.com
 
 

 

Multicore TFN700B is a no-clean, halide-free tacky flux formulated specifically for package-on-package applications. Is a Newtonian-based system; reportedly eliminates shearing conditions associated with traditional tacky flux formulations. Enables optical recognition of flux by pick-and-place systems; permits visual verification of volume before placement of the top component of the PoP. Is suitable for doctor blading and dip transfer for PoP builds. Is ROLO-classified, or non-hydroscopic and non-corrosive.
 
Henkel Corp., www.henkel.com/electronics

 

Spectrum thermal process optimization software is said to automatically identify the correct furnace setup for a thermal profile within the sweet spot of the established process window. Uses information from a single profile pass to evaluate millions of possible furnace setups. Each possible furnace recipe will yield a profile, and the Spectrum identifies the fit between the profile and the established process window. Within seconds, reportedly can complete an exhaustive ranking and present its recommendation for the furnace recipe (zone temperatures and conveyor speed). Is a software-only option for the SunKIC profiler.

KIC, www.kicthermal.com

e-Clipse is said to be fast and convenient to attach, and provides repeatable profile readings. Features four spring-loaded thermocouples within a lightweight fixture that also holds the solar wafer. TCs have disk-shaped beads, rather than the traditional spherical shaped beads, for reliable contact to the solar wafer surface. Permits quick replacement of broken wafers. Four standard type K TC connectors plug into the profiler.

KIC, kicthermal.com

 

 

Multicore DA100 die attach solder paste is suitable for high-lead and Pb-free applications. Incorporates a no-clean, ROLO flux system. Complies with RoHS legislation. Delivers low void formation. Exhibits less that 5% void instances on average. Is formulated to hold a higher metal loading for dispensable applications. Reportedly dispenses easily with high pause time and dot-to-dot consistency.
 
Henkel, www.henkel.com/electronics
 

 

The second-generation Wave Surfer is a self-contained measurement system for wave solder machines. Provides data on wave solder machine setup and profiling. Is said to be easy-to-use, with five embedded thermocouples. Works in conjunction with KIC profilers. Is made of a material similar to typical wave solder pallets, and reportedly withstands thousands of passes. A fixture holds the profiler in place during each run to measure pertinent process data, including peak temperature, dwell time, parallelism, and conveyor speed.

KIC Thermal, www.kicthermal.com

 

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