Gold-Tin die attach solder paste can be reflowed in nitrogen environments with up to 200 ppm oxygen. Aurum 2 uses a special treatment to improve the wetting of eutectic 80-20 AuSn solder powder. The flux component of the solder paste remains the same; no requalification testing is needed. Is halide-free and can be applied by stencil printing or dispensing.
 
Heraeus, www.heraeus-contactmaterials.com 

 

InnoLot solder alloy is for high-temperature and vibration environments. Is capable of operating temperatures of 150ºC and 2000 thermal cycles from -55º to +150ºC. The six-part alloy modifies SAC 387 with the addition of bismuth (3%), antimony (1.4%) and nickel (0.15%) Begins to melt at 206ºC, and becomes fully liquid at 217ºC. Is compatible SAC 305 or SAC 387 processes.
 
Heraeus Materials Technologies, www.heraeuscontact-materials.com

SMT box contacts are for direct PCB mounting. Are capable of being oriented for horizontal or vertical (for bottom post entry) mounting. Will accept 0.025" sq. posts or 0.032" round pins, forming a connection durable for 12 or more mating cycles. The phosphor bronze contacts are RoHS-compliant and finished with a matte tin over copper plating with a current rating of 15A.
 
E-Mark Inc., www.e-markinc.com

 

S2088-II desktop AOI comes with automatic paste print, pre- and post-reflow and THT solder joint inspections. Now includes 8-MB camera, with the same angled inspection and OnDemandHR function as inline systems. Has faster loading and unloading and large PCB fixturing. Has IPC-compliant inspection library. Can be transferred to other systems, including S3088-II, S6056 and X7056. Inspects PCBs up to 20" x 18". 

Viscom, www.viscom.com