Circuits Assembly Online Magazine - New Products

New Products

Rapid Prototyping Services are designed to support the need for faster validation of IC and package designs and speed the transition to full production. Specifically developed to address prototype speed, offering a path to rapidly validate ASIC designs by providing access to advanced interconnect capabilities. Within the medical, communications, defense and measurement markets, three services levels were identified for rapid prototyping-BGA build-to-print, advanced build-to-print and process evaluation build. Entry-level prototyping is offered via BGA build-to-print, assembling JEDEC-standard BGAs in as little as three business days.

Maxtek Components Corporation, www.maxtek.com

RED-E-SET is an installed automatic board center support for pick-and-place machines. Features include manual or automatic lock, improved quality, and reduced changeover time. Is said to be easy to install and remove in the machine; strips can be added as needed. Supports a range of board widths, as well as support lengths up to 24".

Production Solutions Inc., www.production-solutions.com

256Jet-S inkjet printhead features a 256-nozzle printhead for noncontact printing of a variety of acid and alkaline etchants and conductive metals for direct write, printable solar/photovoltaic applications. Reportedly lasts up to eight times longer than alternative inkjet printheads. For use in direct write, precision dispensing of etchants with PH ranging from 2 to 14. Lasts up to three years; has a lifespan of 90 billion firings. Jets a viscosity range from 6 cps to 30 cps. Is available in 5 pl, 30 pl, 50 pl, or 80 pl drops.

Trident, www.trident-itw.com

Automatic Contactor Cleaning, for MT9510, cleans fast and without manual interruption of the handling process. Is fully automated and software-controlled, and requires no opening, undocking, or downtime of the handler during operation. Permits user-defined cleaning cycles. Requires no modifications to the handler base unit, and is said to be easy to install into any existing MT9510 and MT9510XP equipment.

Multitest, www.multitest.com/MT9510

MatchCon series of connectors feature a special contact design for applications with strong vibration exposure, such as automotive. Male and female contacts interlock, providing a high contact force and eliminating the typical fretting seen with Sn-plated versions. Based on a 1.27-mm pitch, provide a variety of 90° and 180° board connectors in SMT and with TH pins. The cable connection is secured by IDC technology and by an additional locking between the board and cable connector. Come in 6 to 26 pin counts.

Yamaichi Electronics, www.yamaichi.de

Galaxy Thin Wafer System offers process capability of Cp>2 @ +/-12.5 µm. A wafer pallet secures wafers as thin as 75 µm during transport and processing. Is approximately 400 mm²; is flat to less than 10 µm; can accommodate wafers as large as 300 mm. Can be held securely while being processed DirEKt Ball Placement, DirEKt Coat wafer backside coating, protective coating imaging, thermal interface materials deposition, wafer bumping and encapsulation. DirEKt Coat process for deposition of 25 µm thick die attach adhesives and other coatings now has process capability of Cp>2 @ +/-12.5 µm and a total thickness variation of 7 µm on 150 µm wafers up to 200 mm in diameter. Said to be capable of first-pass yield ball placement of 200 µm spheres at 3000 µm pitch, thermal interface materials deposition and wafer bumping.

DEK, www.dek.com