WS159 water-soluble solder paste is said to consistently print in volumes down to 12 mm circles and meet IPC-7095 Class III resistance to voiding, using straight ramp and soak reflow profiles. Is reportedly fully cleanable. Is engineered to work with SnPb37, SnPb36Ag2 alloys with Type 3, 4 and 5 solder meshes. Works with OSP, ENIG, immersion silver, and immersion tin finishes. Results in bright, shiny SnPb solder joints, and solder spread on all common pad finishes. Features high-volume repeatability with 16 mm pitch QFP pads, and responds to one-hour pauses, after two knead strokes at 35 to 65% RH.
The stencil cart is redesigned to support Space Saver shelves, which have 0.5" slots and support 50 stencils per shelf. Comes in a multi-level version, as well as staging carts. Shelf mounting tab is fully interchangeable with existing carts; rail height has been shortened. Rails are made from lighter gauge steel.
VW-6000 Series motion analysis microscope has high-speed (up to 24,000 fps) magnified video capture capabilities, for filming failures in moving targets. Is space saving and portable. Comes with a built-in light source and LCD monitor to ease setup and permit light coverage flexibility and observation at any angle. Supports both color and monochrome cameras making it ideal for any application. The advanced interface simplifies the setup procedure, making the unit ideal for novice users. High-speed recording is automatically played back slowly, allowing real-time adjustments during setup. Time Advance function permits video recording at fixed intervals for targets that move continuously. Comparison of multiple videos recorded over the course of a few days will help to easily identify changes from production start to finish. Recorded footage can be edited and analyzed directly on the controller. Automatically tracks moving objects in recorded footage to quantify speed, acceleration, distance, angle, and other measurements. Can be used with certain high resolution digital microscope lenses, for greater magnification.
Master Bond MB514 polypropylene adhesive etches at bonding challenges presented by non-polar and low-energy polyolefin surfaces. The polyolefin-based hot melt is said to be suited for use on untreated surfaces of polyethylene, polypropylene and combinations. Excellent bond performance is said to be retained over a temperature range of -20°F to 190°F. Is VOC-free; is comprised of 100% solids and contains no solvents. Does not require clamps or post cure during assembly. Is reportedly ideal for high-speed assembly operations.
FH12 series FPC/FFC connectors are available with contact pitches of 0.5 and 1.0 mm. ‘Half tuning fork’ contacts maintain standard force without relying on connector housing. Flip-lock actuator is said to eliminate the need for a side latch, permitting placement of two or more connectors side by side; requires 6.9N of force to lock; has a mounted PC board height of 2.0 mm. Available in top or bottom contact point configurations and horizontal or vertical mount styles. Use 0.3-mm thick FPC/FFC. One version can use 0.18-mm thick FPC. Insulation resistance is 500MΩ at 100VDC, with a maximum contact resistance of 50mΩ at 1mA. Current rating is 0.5A DC, with a voltage rating of 50V AC. Operating temperature ranges from -40°C to +70°C.
Work In Process software is based on barcode technology. Is for tracking who is assigned a job, where it is in the plant, and how long it has been in that location. Work order can be tracked to department, task or employee; multiple jobs many be assigned to the Badge, and timeframes may be set for each task and reported when overdue. Is said to reduce late jobs and identify bottlenecks.
