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Static pressure soldering technology is for Pb-free soldering large, high-density products. Enables Pb-free (SnAg3.0Cu0.5) soldering for products up to 490 x 510 mm in size and 6 mm in thickness. Ensures a decent soldering fill without damaging the PWB; enables partial soldering for insertion components.
 
OKI, www.oki.com

 

Miniature Linear Guides feature dowel holes on rail and block. Options include advanced (preload) and standard (interchangeable and small clearance) versions; long or wide blocks, standard or wide rail, all in a variety of dimensions, and varying guide rail with dowel hole lengths. Dowel holes on the rail enable easier positioning; balls remain retained even when the block is removed from the rail. Operating temperature range is from -20º to 80ºC.
 
Misumi USA Inc., www.misumiusa.com
 

 

Double barrel syringes are available in 2.5, 5 and 10 mL capacities; offered in 1:1, 4:1 and 10:1 ratios. Consist of a manual plunger, a dual-cylinder syringe and a static mixer, designed to work together. Are polypropylene. Prevent diffusion of two components.  Provide precise mixing and dispensing. Come in black. 
 
ConProTec, www.conprotec.com

 

A new market and technology study on integrated passive devices lists the existing and upcoming technologies and applications for IPDs. Provides an overview of the thin-film IPD market and growth opportunities. Details each market segment with drivers and benefits of IPDs, sub-segment size and expected growth rate, value chain analysis, and global market evaluation per application. Lists links between IPD technologies and their applications.
 
Yole Développement, www.yole.fr

 

Multi-Cure 9001-E Series encapsulants are said to cure in seconds; no mixing required and viscosity is consistent. Have high ionic purity, are solvent-free, and isocyanate-free. Have a low modulus. Contain no sharp, abrasive mineral or glass fillers. Reportedly display excellent adhesion to polyimide, PET, flexible PCBs, FR-4 and ceramic boards, and provide protection for glob top and chip-on-board applications. Are for encapsulating ICs in flex circuits.
 
Dymax Corp., www.dymax.com

The 7722FV pick-and-place machine mounts most fine-pitch components. Placement accuracy for chips, including 0402s, is ±0.1 mm. Bottom vision delivers an accuracy of ±0.05 mm in mounting SOICs, QFPs and BGAs to 40 mm square with a 0.0015" fine-pitch capability. Offers 56-feeder capacity and 6,000 dph.

Manncorp, www.manncorp.com
 

 

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