AlSiC (Aluminum Silicon Carbide) is a metal matrix composite packaging solution for traditional hermetic packaging applications. Is said to have a lower density value – 1/5 to 1/6 lighter in weight than CuMo and CuW, respectively – yet similar thermal conductivity and expansion coefficient. Designs reportedly are cast to the final shape, requiring no secondary machining. Net-shape casting capability enables direct creation of functional design features, such as pockets for circulators and cavities or pedestals for the die. A hermetic package assembled with an AlSiC base brazed to an alloy 48 frame is hermetic to better than 10-9 atm-cm³/s. Is RoHS compliant.
 
CPS Technologies Corp., www.alsic.com
 

Electrolock-XP RoHS-compliant solder pallet material is molded under high pressure, reportedly providing a lower profile surface chemically inert and heat-resistant. Is said to meet flatness and thickness requirements without surface grinding; sustains more than 12,000 cycles of operation with virtually no surface degradation. Is compatible with Pb-free solder and halide flux systems. Can be used as carrier in wave solder and SMT processing applications, including Pb-free soldering, conformal coating, composite tooling, and ESD-safe tooling.