VP5000 inline 3-D SPI system has a large field of view said to reduce the number of images required to inspect the board. Has tabbed menus in touch screen interface. Includes warning thresholds to the pass/fail outputs. Comes with an interface to Qup-Navi software that enables the height calculation and volumetric inspection data to be incorporated into a root cause of failure analysis. Uses color stripe phase shift method. Combines RGB (red-green-blue) light sources and a 3-CCD camera with texture mapping or gradation displays. Inspects for average height, volume, excessive deposition, insufficient solder, smearing, misalignment and bridging. Has an interface to import Gerber and CAD data. Locations of defective pads are displayed on the substrate map with up to eight raw images of defective pads. Multi-data station 5000DS uses one PC and can handle up to six machines for off-line programming and analysis of production data, line status, and machine waiting time for parts. Accepts substrates from 2" x 2" up to 18" x 20" and provides 12 µm resolution with a 23 x 31 mm field of view. A 2-D code reading option enables the camera to read Data Matrix (ECC200) and QR (Model 2) codes.

Omron Electronics, www.omron247.com  
 

 

The free Intermediate Data Format Plug-In is the first plug-in module for PCB123 based on the v. 3.1 Software Developer’s Kit. Enables import of PCB designs for use in mechanical and electrical CAD systems in a bidirectional, neutral format within the ECOsystem Design Environment. Imports outline definitions of the PCB as specified by the mechanical CAD tool, synchronizing the mechanical design work with the PCB development work.
 
Sunstone Circuits, http://www.sunstone.com/products-services/cad-software.aspx
 
 

FLX2010C is for placement of special components on film or flex boards. Features a conveyor system said to permit flexible and fast placement on the substrate. Can be placed upstream in the line before a die bonder. In a downstream pick-and-place process, components reportedly are accurately placed on these dice, where the sandwich carrier will be inserted from the left side and stopped by a "stopin" mechanism. The carrier is located with a chuck. Nozzles suck in from the underside of the sandwich carrier at defined positions. The substrate can be populated from conventional component feeder systems after the alignment of the fiducials. The film leaves the placement machine via the conveyor after the release of the sandwich carrier from the vacuum.
 
Essemtec AG, www.essemtec.com