SSF-400 has a novel two-part mixing nozzle said to reduce clogging and ease maintenance. Includes automatic cleaning system for the conveyor chain, upper and lower exhaust fans, and color LCD touch panel. Handles boards up from 2" x 4" to 16" x 16". Coating width range is 2" x 16".
ProcessWatch production control suite traces boards and records events throughout the assembly process and tracks associated consumables, stencils and tooling. Benefits include stencil/board/tooling compatibilities, materials aging, and events alerts. Follows individual board batches and records all events during production; tracks stencils and provides alerts about use, cleaning requirements and design revisions and obsolescence; follows consumables (solder pastes, adhesives); checks board/consumable/stencil compatibility; prints reports covering a specific production batch; traces individual boards and reviews conditions under which each has been produced.
The Advanced Starter turnkey line is for prototyping and other low-volume assembly. Consists of a stencil printer, a full-function automatic pick-and-place system and a Pb-free conveyor reflow oven. Only options are feeders. ECM-6711S placer has on-the-fly top vision plus bottom vision, 24-lane feeder base, 13.75" x 9.8" placement area, computer and LCD monitor; is suitable for fine-pitch devices and BGAs. Stencil printer is 4500 with X, Y and theta adjustments for fine-pitch SMT printing of single or double-sided boards. Also features TN350 Pb-free forced hot air convection reflow oven with five upper and lower heat zones, each with independent PID controllers settable to 320ºC at accuracy of ±1ºC.
This pick-and-place system is capable of placing 3-D-MID technology. Is based on inline pick-and-place FLX2011-LCV system. Is completed by a palette transport system, a five-axis robot and a dispensing head with two valves. A free-motion robot arm is located in the chassis and grips the 3D-MID module from the transport system. Dispensing head is equipped with two individual touch-less dispensers: one for precise dispensing of solder paste, the other for accurate metering of fast-curing adhesive. Solder paste is applied to the electrical contact surfaces. Glue is dispensed on other locations to hold the SMD part until the reflow process and absorb mechanical stress. SMD components are placed with a vacuum tool and are picked from feeders, measured and aligned by an optical centering system, then placed to contact surfaces. Standard components are aligned on-the-fly with a laser system. For BGA, QFN and QFP, Cognex Vision is used.
DispenseJet DJ-100 piezoelectric jets are said to be suitable for a range of fluid types and viscosities. Three models are available, each designed to dispense different types of fluid: DJ-100 Standard, DJ-100 NC for low viscosity materials, and DJ-100 GH, designed for highly viscous fluids. Novel “Jet on the Fly” technology reportedly shoots precise volumes in dots, lines and patterns. Reportedly eliminates Z-axis movement. Can achieve flow rates up to 200 mg/sec. and shot rates up to 150 dots per sec. Come with a serialized hardware set that includes a matched ball and seat. Calibrated Process Jetting uses weigh scale feedback to maintain consistent dispense volume. Achieve dot diameters as small as 200 µm.
Niton XL3t is said to deliver improvements in light element detection, overall sensitivity and measurement times as much as 10 times faster than conventional Si-PIN detectors, and up to three times more precise than conventional silicon drift detectors. Permits light element detection of magnesium, aluminum, silicon, phosphorus and sulfur without helium or vacuum purging. Incorporates 80 MHz real-time DSP and dual embedded processors for computation, data storage, live video processing, and communication. Software permits users to customize the instrument; set user permissions; generate custom reports; print personalized certificates of analysis; remotely monitor and operate the instrument hands-free from a PC or PDA. Can locate areas of interest on a sample using the integrated color CCD camera and optional integrated 3-mm small-spot collimation.