S6053BO-V fully automatic wire bond inspection system is for small wire bond analysis. The camera technology and the transport reportedly can be adapted to varying production demands. Is equipped with a universal, high-resolution VHR camera module. Can inspect down to 2 to 5 µm per pixel. Camera module can be arrayed with one or several cameras and illumination units. Bond wires smaller than 20 µm in diameter can be inspected 100%. Is available in a dual track configuration, including an integrated shuttle that loads the second track as an inspection is conducted on the first track. Is configured for fine bond wire analyses. Also said to inspect components and ASICs with high accuracy.
 
Viscom, www.viscom.com
 

Easy Lift is an ergonomic workbench with 20" of adjustable work surface. Serves as a workbench, assembly station and adjustable desk. This ESD-safe work surface is approved for static-sensitive electronics assembly and non-ESD applications. The table moves vertically and has a 250 lb. load capacity. Comes standard with a 24 x 30" static dissipative powder-coated steel tabletop with ESD-safe Blue Softsurface matting material. Has foot pedal and adjusts from 19" to 39".