Circuits Assembly Online Magazine - New Products

New Products

Desktop Companion II is a prototype solder paste printing tool created as a solution to printing inconsistently routed boards. With a desktop stencil mounted to adjustable plate, two tension screws can be loosened, permitting stencil movement in the x and y axis.

Integrated Ideas & Technologies, Inc., www.integratedideas.com

Eco-Reflow SNR series of reflow ovens operate in nitrogen or ambient conditions. Come with six to eight heating zones, individual heater temperature settings, and top and bottom cooling. Include IR panel heaters and novel air blowers to improve thermal efficiency. Dimensions range from 9' to 19' long, and about 5' wide. Handle boards from 2" x 4" to 20" x 20". Optional PCB warp prevention, automatic conveyor width adjustment, chiller and thermal profiler.

Senju Metal Industry Co., www.senju-m.co.jp/

SSF-400 has a novel two-part mixing nozzle said to reduce clogging and ease maintenance. Includes automatic cleaning system for the conveyor chain, upper and lower exhaust fans, and color LCD touch panel. Handles boards up from 2" x 4" to 16" x 16". Coating width range is 2" x 16".

Senju Metal Industry Co., www.senju-m.co.jp/

ProcessWatch production control suite traces boards and records events throughout the assembly process and tracks associated consumables, stencils and tooling. Benefits include stencil/board/tooling compatibilities, materials aging, and events alerts. Follows individual board batches and records all events during production; tracks stencils and provides alerts about use, cleaning requirements and design revisions and obsolescence; follows consumables (solder pastes, adhesives); checks board/consumable/stencil compatibility; prints reports covering a specific production batch; traces individual boards and reviews conditions under which each has been produced.

Novatec EAP, www.novatec-eap.com

The Advanced Starter turnkey line is for prototyping and other low-volume assembly. Consists of a stencil printer, a full-function automatic pick-and-place system and a Pb-free conveyor reflow oven. Only options are feeders. ECM-6711S placer has on-the-fly top vision plus bottom vision, 24-lane feeder base, 13.75" x 9.8" placement area, computer and LCD monitor; is suitable for fine-pitch devices and BGAs. Stencil printer is 4500 with X, Y and theta adjustments for fine-pitch SMT printing of single or double-sided boards. Also features TN350 Pb-free forced hot air convection reflow oven with five upper and lower heat zones, each with independent PID controllers settable to 320ºC at accuracy of ±1ºC.

Manncorp, https://www.manncorp.com/turnkey/

This pick-and-place system is capable of placing 3-D-MID technology. Is based on inline pick-and-place FLX2011-LCV system. Is completed by a palette transport system, a five-axis robot and a dispensing head with two valves. A free-motion robot arm is located in the chassis and grips the 3D-MID module from the transport system. Dispensing head is equipped with two individual touch-less dispensers: one for precise dispensing of solder paste, the other for accurate metering of fast-curing adhesive. Solder paste is applied to the electrical contact surfaces. Glue is dispensed on other locations to hold the SMD part until the reflow process and absorb mechanical stress. SMD components are placed with a vacuum tool and are picked from feeders, measured and aligned by an optical centering system, then placed to contact surfaces. Standard components are aligned on-the-fly with a laser system. For BGA, QFN and QFP, Cognex Vision is used.

Essemtec AG, www.essemtec.com