The FLX2010 MKL placement machine now comes with a three-head system that performs material dispensing and consecutive placement of LEDs on film substrates. Features a placement axis with an integrated component adjustment mechanism, as well as two independent axes with a piezo flow valve and a time-pressure dispenser gear. Dispensing valves are mounted on motorized, closed-loop driven linear axes. Is said to handle substrates up to 800 x 600 mm. Substrates are vacuum-secured. Vacuum is activated with a foot-operated switch, and the film substrate sticks to the table. A time-pressure dispenser applies three dots of isolating adhesive on the substrate. Solder paste dots are applied on the substrate solder pads using a piezo-controlled PFV nozzle. LEDs are picked from standard feeders, adjusted and placed. The isolating adhesive reportedly eliminates unwanted electrical contact between the solder dots.

Essemtec AG, www.essemtec.com

CircuitSpace v2.2 permits bi-directional communication between layout and a PDF schematic. Is said to provide instant selection and verification of design elements such as components, nets or pins, within Cadence Allegro and schematic. Cross-probing permits populating any selection set through interactive clustering. Is said to reduce board layout and placement time to minutes with AutoClustering, design reuse, and cross-probing. Features concurrent layout development project wide; template generation for global library usage across divisions; template usage with and without etch; automated layout reference designator propagation; advanced sustaining engineering and ECO process; automated change report between layout designs and availability.

DesignAdvance Systems Inc., www.designadvance.com