New Products
The LTS200 Lead Tinning System is a programmable, automated machine that reconditions component leads for hi-rel and/or RoHS applications. Can be used for conventional lead tinning or for re-conditioning SnPb parts. Built using designs and components from KISS Selective Soldering systems, including the KISS-ware OS. Has a central fluxing station with two solder pots. Can be programmed to handle transistors, capacitors, diodes, axials, radials, QFPs, pin grid array, sips, dips and connectors.
ACE Production Technologies, www.ace-protech.com
ACE Production Technologies, www.ace-protech.com
A series of nine turnkey lines are targeted to diverse production and budget demands. Each include a pick-and-place machine, stencil printer and Pb-free reflow oven, with conveyors and board-handling equipment available. Lines include high-mix, mid to high-speed, as well as low-volume starter and lab.
Manncorp, www.manncorp.com/turnkey
Manncorp, www.manncorp.com/turnkey
The SV-100 Slider Valve for solder paste dispensing is said to be up to 20% faster than standard auger dispensers; reportedly achieves 20,000 dots per hr. (on 1 mm grid) while delivering dots of less than 300 µm (0.012") for solder paste types 4, 5 and 6. Dots as small as 125 µm (0.005") in diameter can be achieved with type 6 paste. Dispenses dots and lines of pastes and fluids that contain metal additives with minimal clogging. Is compatible with Pb-free and no-clean solder pastes and silver-filled epoxies. Is for solder paste dots for passive components smaller than 0603, rework of BGA and QFN electrical connections, lines and patterns for RF shield attach, low-volume/high-mix applications, and unique patterns of conductive epoxy.
Asymtek, www.asymtek.com
Asymtek, www.asymtek.com
Loctite 5210 is a fast-cure thixotropic silicone material said to be ideal for devices in harsh environments. Offers alternative to hot-melt glues. Is a non-corrosive room temperature vulcanization silicone material designed for wire tacking, selective sealing, vibration dampening, and rework/repair applications. Reportedly has dispense times as little as 31 sec. for two connectors and a tack free time of fewer than 5 min. Offers a high UPH alternative. Material reportedly will hold its form and will not spread or migrate to other locations. Cures at room temperature.
Henkel Corp., www.henkel.com/electronics
Henkel Corp., www.henkel.com/electronics
Circuit Suds biodegradable cleaner was formulated to be environmental friendly. Is said to be suitable for no-clean, rosin, and Pb-free processes. No special handling or disposal reportedly required in the majority of applications; is non-flammable and non-volatile. Can be disposed of as ordinary wastewater with few exceptions. For hand-cleaning through automated lines. Comes in 1 gal., 5gal. and larger containers.
Circuit Suds, www.circuitsuds.com
Circuit Suds, www.circuitsuds.com
Easyplacer 7.2 is a software upgrade for the CLM/FLX-Series placement systems. Is said to enhance the application range. Was standard on all FLX-Series deliveries after Feb. 1. The package includes Easyplacer version 7.2.0.0, BOX version 7.5.0.0, LIB version 7.2.0.0, and optional CAD version 7.2.0.0. Includes job function, lifetime counter, production time counter, selectable speed or accuracy optimization, 01005 placement with special nozzle, warning message if a local fiducial mark is not found, and more precise placement of MFOV components. BOX 7.5.0.0 includes expanded job function. LIB 7.2.0.0 includes corner marking of palettes, selectable speed or accuracy optimization for each component, free definable rotation speed of a-axis for each component, vacuum activation at pick position, and definable vision window angle for each component in advanced setting.
Essemtec AG, www.essemtec.com
