Circuits Assembly Online Magazine - New Products

New Products

SR-37 LFM-22S no-clean cored solder wire is said to enhance cost-efficiency and yield through a range of tip-saving properties. For applications that don’t require silver.

Almit, www.almit.com

Solder cup headers and mating socket connectors terminate discrete wires into a pluggable interconnect. Are said to provide a pluggable, reliable path between your wired applications. Are manufactured using precision-machined brass alloy and beryllium copper contact clips; assembled in high-temperature thermoplastic. Reportedly offer a gas-tight connection when mated with solder cup header pins. Are pre-aligned in the connectors. Are available in single and double rows up to 64 pins.

Mill-Max, www.mill-max.com

The Extech i5 compact IR camera is for thermal imaging, with focus-free viewing and 5000-image miniSD card storage. Monitors and detect the thermal condition of electrical system components. Reportedly can inspect areas that can’t be reached with thermocouples or other contact-based instruments. High-res images pinpoint problems in need of repair. Is said to deliver accuracy of 2% and thermal sensitivity of 0.18°F/0.1°C. Is 12 oz. Features a 2.8" high-res color LCD.

Extech Instruments, www.extech.com

The Nexus System workbench is designed for electronics, research, assembly and technical work. Can be customized. Has heavy-gauge upright frames with notches in the front and back, to mount accessories on either side. Accessories include tool rails, lights, shelves, pivoting arms, and monitor/accessory trays. Electrical and air power attachments can be added as well. Overhead cabinets can be added for storage. Is ergonomically designed.

Lista International Corp., www.listaintl.com

LFM 48 N is a no-clean, Pb-free alternative to gel pastes traditionally used in BGA PoP stacked device applications. Is for holding larger area devices that often exhibit warpage during reflow. Combines ultra-fine solder spheres and a low-voiding, thermally stable flux vehicle. Formulation comprises SAC 305 with a solder powder size of 4 to 24 µm. Features reported open time in a dipping tray 8 hrs. at 23°C and 50% RH, and up to 8 hrs. process window time between dipping and reflow.

Almit Ltd., www.almit.com

The Horizon 01i screen printer now has a reported accuracy of 2.0 Cpk @ +/-25 µm, and can output DPMO statistics. The Horizon 03i now comes with Cyclone understencil cleaning, said to reduce changeover times and paper volume. And the Horizon platform range now comes with HawkEye post-print verification, said to verify 100% of boards in line beat rates (acquisition speeds: 750 to 1700 sq. mm per sec.).

DEK, www.dek.com