Circuits Assembly Online Magazine - New Products

New Products

V400 software reportedly reduces programming time 40%. Creates customer libraries automatically, permitting users to deploy the same library in different process stages from first-off inspection until post-reflow or post-wave soldering. Includes a calculation algorithm that operates with synthetic imaging algorithms; facilitates the deployment of rule-based algorithms. Is said to be ideal for high-volume production. Features an improved color-modeling algorithm.

Marantz Business Electronics, www.marantz.com/bus/eu/

The Nitrogen Peel-Off Jet is said to improve fine-pitch selective soldering results. Provides a 360º, directional jet of preheated nitrogen to assist in minimizing solder accumulation on specific solder joints. Reportedly wets surface with minimal amount of solder required.

ACE Production Technologies Inc., www.ace-protech.com

Model LX30 single-axis actuator comes with or without a motor bracket, with one or two short blocks, or one or two long blocks. All configurations are available in a covered version. Model LX45 (to be introduced July 1) will come with or without a cover, with or without a motor bracket, and in the same block configurations as the LX30. LX Series models will be available in 1,000 possible configurations. Provide precision linear motion for automated assembly operations.

Misumi USA, www.misumiusa.com

Spectrum S-822 has dual-shuttle stages for chip scale package underfill and other electronics applications. Is standalone and offers controlled precision dispensing capabilities. Permits parallel processing on two shuttle stages for continuous dispensing; stages automatically slide in and out through an opening in the front of the machine. Options include choice of impingement or contact heated stations. Jet-on-the-Fly dispenses lines of dots continuously. Calibrated process jetting uses weight control. Dynamic dispense control offers flexible control parameters through closed-loop servo technology. Mass flow control uses weight-controlled dispensing and automatic calibration. Comes with Fluidmove software and ESD glass and has passed all EMC testing for CE certification.

Asymtek, www.asymtek.com

Amkor’s middle stacked package that makes a Triple Stack PoP package is available in a dummy version. Is identical to the live package, without the die. Is said to be made of the same materials on the same manufacturing lines and have the same size, thermal and soldering properties as the live equivalent.

Practical Components, www.practicalcomponents.com

The FLX2010 MKL placement machine now comes with a three-head system that performs material dispensing and consecutive placement of LEDs on film substrates. Features a placement axis with an integrated component adjustment mechanism, as well as two independent axes with a piezo flow valve and a time-pressure dispenser gear. Dispensing valves are mounted on motorized, closed-loop driven linear axes. Is said to handle substrates up to 800 x 600 mm. Substrates are vacuum-secured. Vacuum is activated with a foot-operated switch, and the film substrate sticks to the table. A time-pressure dispenser applies three dots of isolating adhesive on the substrate. Solder paste dots are applied on the substrate solder pads using a piezo-controlled PFV nozzle. LEDs are picked from standard feeders, adjusted and placed. The isolating adhesive reportedly eliminates unwanted electrical contact between the solder dots.

Essemtec AG, www.essemtec.com