FLX-CVU comes as an option for the FXL2011 placement machine and verifies component electrical characteristics. Reportedly prevents setup flaws and wrong placement actions as a result of labeling and packing errors, localizes divergences in component reels, and eliminates placement of out-of-spec parts. Measurement values are stored in a database and permit traceability to single parts. Measurement unit is directly integrated into machine; contacts are designed so that components with different outlines and form factors can be tested. Complex adjustments, setup and calibration of test contacts or hooks are said to be unnecessary. The contacting unit is linked to a universal instrument that measures resistance, capacitance and inductance. Measurement takes place immediately after picking from the feeder.

Essemtec AG, www.essemtec.com
 

XF3 Pb-free solder paste accommodates extended reflow profiles without the use of nitrogen and is based on the patented SN100C alloy. Reportedly wets well to all common metal surfaces. Prints at 150-200 mm/sec, and reduces voiding.\

Balver Zinn, www.balverzinn.com  

CAM350 Release 10 PCB verification and optimization software integrates with the Blueprint document authoring tool. Reportedly creates and distributes deliverables required for a complete PCB fabrication and assembly release package in one electronic file. The electronic release package can be used to distribute, view and extract documents, Gerber files, NC drill/mill data and panel designs. Includes a redesigned user interface. Other features include a universal release package navigator; a project explorer bar; a flip panel; design compare; crossprobing to Mentor Graphics Expedition; longer file and net name support; netlist and streams enhancements; PADS interface and usability updates, and defect fixes.