Circuits Assembly Online Magazine - New Products

New Products

Easyplacer 7.2 is a software upgrade for the CLM/FLX-Series placement systems. Is said to enhance the application range. Was standard on all FLX-Series deliveries after Feb. 1. The package includes Easyplacer version 7.2.0.0, BOX version 7.5.0.0, LIB version 7.2.0.0, and optional CAD version 7.2.0.0. Includes job function, lifetime counter, production time counter, selectable speed or accuracy optimization, 01005 placement with special nozzle, warning message if a local fiducial mark is not found, and more precise placement of MFOV components. BOX 7.5.0.0 includes expanded job function. LIB 7.2.0.0 includes corner marking of palettes, selectable speed or accuracy optimization for each component, free definable rotation speed of a-axis for each component, vacuum activation at pick position, and definable vision window angle for each component in advanced setting.

Essemtec AG, www.essemtec.com

MC683 is a four-head dual gantry pick-and-place system. Includes Cognex on-the-fly vision alignment, for 0201s, SOICs and µBGAs, while bottom vision handles 0.015" pitch QFPs and large BGAs. A plug-and-play feeder docking trolley can be configured and loaded off-line. Is configured with two pairs of heads that work independently on each gantry. The ball screw driven system has DC-servo motors and closed-loop, non-contact linear encoding for ±0.01mm X-Y repeatability. An automatic 3-stage conveyor contributes mounting speeds of up to 10,500 cph.

Manncorp, www.manncorp.com

MFR-2200 Series is for production hand soldering, touchup and SMD rework. Incorporates SmartHeat technology and the ability to operate different handpieces simultaneously. Includes a range of soldering and rework cartridges, similar to Metcal, and tips, including a cartridge handpiece with a variety of fine access and SMD rework tips, a high-power soldering tip handpiece designed for volume production environments, and a precision tweezer handpiece capable of removing a range of components from 0201 chips to 28mm SOICs.

OK International, www.okinternational.com

Hysol FF6000 reflow-cured encapsulant material combines flux functionality and underfill protection. Is formulated to provide flux for Pb-free solder joint formation. When cured, reportedly delivers protection against mechanical stress. Bottom-side spheres are dipped prior to component placement; device is placed onto PCB or substrate, and then travels through reflow. Flux provides action necessary for solder joint formation, and the epoxy encapsulates each solder sphere. Is said to eliminate the need for dispensing equipment and the time required for underfill application and cure. Is suited for package-on-package device configurations and large BGAs and CSPs.

Henkel, www.henkel.com/electronics

Elpeguard SL 1307 FLZ series conformal coatings are 1-pack fast-drying polyacrylic resins for yellowing resistance. Cured ink film can be soldered through at soldering iron temperature; can be removed by means of the product-specific thinner. The colorless fluorescent adjustments are approved as permanent coatings per UL 94; meet requirements of IPC-CC-830B.

The Twin-cure DSL 1600 E-FLZ series has low viscosity thick-film lacquers. Offers corrosion protection. Meets requirements of UL 94 and IPC-CC-830B. Has short processing times. Thin protective coats of around 80 µm can be realized.

The yellowing-stable white-opaque photoimageable solder resist Elpemer SD 2491 SM-TSW and corresponding marking ink Elpemer SD 2691 TSW are applied by screen printing and developed in aqueous-alkaline media. The latter corresponds to the flame class V-0 according to UL 94, meets requirements of IPC-SM-840D and is halogen-free per JPCA-ES01-2003/IEC 61249-2-21.

Wepuran casting compound VU 4490/31 K is based on polyurethane resin and is yellowing-resistant. The smooth white surface gives a high-grade finish. Is said to be easy to process in mixing and dispensing equipment; can be processed by hand despite short pot life. Is said to be fast curing. After slight heating to 40°C, the potting can be removed from its mould after 10 min.

Lackwerke Peters, www.peters.de

vPlan version 1.2 introduces features intended to enhance the ability to transfer production between lines and factories, even when CAD and AVL data are not available. Reportedly can create efficient manufacturing process definitions, even when incoming data are of poor intelligence-level. Adds coverage for additional machine models. New features include re-optimization of legacy NC programs; the ability to import existing machine programs; re-engineering of Gerber data; extraction of footprint data and component list from Gerber; enhanced ability to align CPL data with Gerber data; bottom-up auto generation; alternate IPN Support; moving BoMs from one line to another and moving parts data automatically; standard workflows; 10,000 vShapes added to built-in shape library.

Valor Computerized Systems Ltd., www.valor.com