Bondjet BJ820 automatic wedge bonder, for round wire and deep access ribbon and wire bonding, is said to handle fine-pitch applications on a single platform, including RF and microwave devices, COB, MCM and hybrids, fiber optics and automotive – using aluminum or gold wire or ribbon. Reportedly has speeds up to 7 wires/sec. Axis repeatability of 1 μm at a balanced encoder resolution of 20 nm. A 12" x 16.1" work area can serve as two or more smaller stations. Capabilities include 12.5 to 85 μm diameter wire bonding; ribbon bonding from 6 x 35 μm to 25 x 250 μm; constant loop height and wire length; parallel loops within mixed reference system; auto teach for linear applications. Has a footprint of 720 x 1250 mm.

Hesse & Knipps, www.hesse-knipps.com   

Conap Conathane EN-3010 is a filled two-component polyurethane potting compound. Is UL94 V-O recognized and RoHS compliant. Is flexible and is said to have a fast cure rate and low viscosity. Reportedly exhibits mix of 70 Shore A hardness, 100% modulus of 668 psi, and 139% elongation; has processing properties of 2,400 cps mixed viscosity at 25° C, 2:1 volumetric mix ratio, fast gellation, excellent storage stability, and a non-abrasive filler. Is suited for aerospace, automotive, computer, and defense SMT applications.

Cytec Industries Inc., www.cytec.com/conap

Practical Components Inc., www.practicalcomponents.com

Select Technomelt hot melt adhesives are offered in finger-sized, ready-to-use packets. Load directly into the dispensing tank; the dry outer casing melts with the adhesive. Designed to replace sticky cavity packaging and plastic waste. Are available in 28 lb. boxes. Available in ethylene-vinyl-acetate, polyolefin and pressure sensitive technologies. Are used to manufacture filters, packaging, pressure sensitive adhesive films, insulation, textiles, vehicles, and structures.

Henkel Corp., http://www.henkelna.com