New Products
vPolyTan T50 surface-mount polymer tantalum molded chip capacitors are for high-temperature, high-humidity operating conditions.
Micronox MX2120 multi-metal safe power module cleaner is an aqueous, single-phase cleaner designed to remove tough flux residue from power modules that use nickel and most copper DBC as substrates.
MYPro I series 3-D AOI offers redesigned ergonomics, as well as new programming tools that reduce programming time by up to 30%.
Bonding system is designed to bond replacement circuit patterns such as surface mount pads, BGA pads, and plated hole pads to PCBs.
Press Releases
- SIA Applauds CHIPS Act Incentives for Amkor Facility in Arizona
- ASMPT and IBM Deepen Collaboration to Advance Bonding Methods for Chiplet Packages for AI
- Murray Percival Company Expands Product Line with Representation of BIMOS ESD Seating in the Midwest
- Selectronic Assembly Welcomes Eliud Herrera as Production Manager