New Products
New software on 3Xi-M110 inline 3D-AXI system for printed circuit board inspection reduces cycle time up to 50%.
VT-S10 series 3D AOI uses multi-direction, multi-color imaging, MPS 3D hardware and AI to reduce false calls, improve first-pass yields and optimize defect detection.
Meister D+ True3D inspection system is for chiplets and system-in-package devices, including die and surface mount components.
Includes enhanced support for flex/rigid-flex and embedded component visualization in 2-D and 3-D environments.
Alpha WS-826 water-soluble solder paste is designed to provide excellent environmental stability in extreme operating conditions.
JM-50 SMT placement machine uses Takumi placement head, which automatically adjusts its height to provide optimal speed and component handling simultaneously.
Press Releases
- SIA Applauds CHIPS Act Incentives for Amkor Facility in Arizona
- ASMPT and IBM Deepen Collaboration to Advance Bonding Methods for Chiplet Packages for AI
- Murray Percival Company Expands Product Line with Representation of BIMOS ESD Seating in the Midwest
- Selectronic Assembly Welcomes Eliud Herrera as Production Manager