New Products
LED405FL3 is a one-component LED curing adhesive with optical clarity and a refractive index of 1.51.
VeriSpector is an AOI for use on manual and semiautomated SMD and THT assembly stations.
Draloric RCC1206 e3 thick-film chip resistor in 1206 case size now has higher power rating of 0.5W.
NexygenPlus 4.1 materials testing software is for testing physical properties of raw material prior to processing, and for development of new electronics design and functionality.
3880-II die bonder includes options to maximize productivity, reduce programming time by up to 95% and improve bonder productivity.
Press Releases
- SIA Applauds CHIPS Act Incentives for Amkor Facility in Arizona
- ASMPT and IBM Deepen Collaboration to Advance Bonding Methods for Chiplet Packages for AI
- Murray Percival Company Expands Product Line with Representation of BIMOS ESD Seating in the Midwest
- Selectronic Assembly Welcomes Eliud Herrera as Production Manager