New Products
Draloric RCV-AT e3 thick-film chip resistors are AEC-Q200-qualified and have operating voltages up to 3kV in 2010 and 2512 case sizes.
Vivid Cure LCD edge bonding adhesives are for high-speed LCD display assembly and are compatible with HumiSeal face bonding products.
Intelli-Pro AI smart factory automation software and algorithm package is designed for improving performance of AOI machines.
Etimol SW 25/FD RAN cleaning agent is drying-optimized and has been developed for SMT stencil washing systems that have no or insufficient heating or drying.
EP5G-80 is a one-component, NASA low outgassing rated epoxy with temp. cure requirement of 80°C for 4 hr.
i-Cube10 (YRH10) hybrid placer has surface mounter functions for electronic components and a die bonder for wafer components.
Press Releases
- SIA Applauds CHIPS Act Incentives for Amkor Facility in Arizona
- ASMPT and IBM Deepen Collaboration to Advance Bonding Methods for Chiplet Packages for AI
- Murray Percival Company Expands Product Line with Representation of BIMOS ESD Seating in the Midwest
- Selectronic Assembly Welcomes Eliud Herrera as Production Manager