Yincae Rolls Out UF 120HA Underfill
Published: 26 June 2023
Yincae's UF 120HA material is designed to provide a fast flow, lower-temperature cure for high-throughput application.
Is 100% compatible with all no-clean flux residue and is reworkable, making it an ideal solution for manufacturers looking to reduce costs and improve production efficiency. Offers a temperature snap cure at <120oC, passes 5×260oC without any deformation of the solder joint, has a low CTE and is able to flow into small gaps.
Yincae
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