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New Products

SLX is a zero-setup profiling system for reflow and wave solder applications.

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Solderstar VP Nano captures thermal profiles of electronics assemblies that use numerous components or require higher mass PCB substrates.

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ISO-Spector M2 inline 3-D AOI system with artificial intelligence is for high-end electronics assembly.

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Draloric RCV-AT e3 thick-film chip resistors are AEC-Q200-qualified and have operating voltages up to 3kV in 2010 and 2512 case sizes.

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Vivid Cure LCD edge bonding adhesives are for high-speed LCD display assembly and are compatible with HumiSeal face bonding products.

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Intelli-Pro AI smart factory automation software and algorithm package is designed for improving performance of AOI machines.

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