ER6006 and ER7006 Bio epoxy resins provide good flow characteristics to allow potting of difficult and complex geometries. ER6006 is two-part high thermally conductive epoxy encapsulation resin primarily developed for encapsulation of LED driver units.

Siplace SX pick-and-place machine has new placement head versions, a more powerful vision system, open interfaces for special feeders and new software functions.

Viscom X7056-II BO inspects bond wires optically and radiographically in an inline system that reportedly ensures inspection of power semiconductors and encapsulated sensor elements.

With Microfactory, manufacturers can now deploy and operate automated assembly lines with fewer people.