Lead-free Soldering Process Development and Reliability, edited by Jasbir Bath, covers Pb-free soldering, such as developments in process engineering, solder alloy development, intermetallic compounds, PCB surface finishes and laminates, underfills/encapsulants, conformal coatings and reliability assessments.

Authors are from OEM, EMS, soldering material and equipment supplier companies and universities. Is a reference for research, development, and production. 450+ pages.

Wiley
wiley.com/en-us/Lead+free+Soldering+Process+Development+and+Reliability-p-9781119481935

SMTA Online Store
smta.org/store/viewproduct.aspx?id=16804440

Koki Co.
ko-ki.co.jp

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