813-76 is a two-component room-temp.-curing thermally conductive and electrically insulating adhesive.

Is designed for assembling heat-sensitive components on PCBs. Provides high-impact bonds that improve heat transfer while maintaining electrical insulation. Bonds to variety of surfaces; has a low coefficient of expansion; provides resistance to mismatched substrates. Is chemical-resistant; shows low shrinkage; passes NASA outgassing requirement (ASTM-E-595).

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