HiTech CU21-3240 and CU31-2030 are one-component capillary underfills designed to protect assembled chip packages on printed circuit boards.

CU21-3240 exhibits thermal cycling performance due to low coefficient of thermal expansion. Is suitable for applications with high-reliability requirements such as automotive. CU31-2030 low-viscosity underfill enables efficient flow properties. Is suitable for assembling BGA, CSP and-flip chip devices; is also reworkable.

MacDermid Alpha Electronics Solutions
MacDermidAlpha.com

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