HiTech CF31-4010 is a one-component, high filler content, heat-curable cornerfill.

Is epoxy-based material to be dispensed on the corner (corner bonding) or edges (edge bonding) of BGA devices. Upon completion of curing process, cured cornerfill helps strengthen soldered assembled component, allowing it to pass reliability tests such as drop shock, impact bend and thermal cycle; is also reworkable.

MacDermid Alpha Electronics Solutions
MacDermidAlpha.com

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