Indium Releases Indalloy 303 Low-temperature Alloy
Published: 11 April 2023
Indium's Indalloy 303 is a bismuth-based alloy developed for low-temperature reflow processes.
Features reflow temperature as low as 170℃, excellent thermal cycling performance, resistance to hot tearing, compatibility with SAC in hybrid BGA joints, and low voiding.
Its flux vehicle, Indium5.7LT-1, delivers superior print transfer efficiency; clear post-reflow flux residue; solder bead and solder ball minimization; exceptional wetting on OSP, Immersion Ag, Immersion Sn, and ENIG; excellent coalescence of small deposits; and outstanding SIR performance under challenging low-temperature reflow conditions.
Indium Corporation
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