Master Bond's LED415DC90Med is a one component, dual cure adhesive system designed for high-speed manufacturing of medical electronic devices.

Cures rapidly without oxygen inhibition upon exposure to 405nm LED light, followed by a short 30-45 min. heat cure at 90-95°C, making it well-suited for bonding heat sensitive components. Passes ISO 10993-5 requirements for non-cytotoxicity and resists common medical sterilants, including glutaraldehyde, peracetic acid, ethylene oxide and gamma radiation. Can partially cure or fixture sections up to 6mm deep when exposed to 405nm LED light at the appropriate intensity and for a sufficient duration, enabling the fixturing of opaque components by allowing light penetration through the adhesive from the sides. Has a thixotropic index of 5.53 at room temperature, exhibits a tensile strength of 5,500-6,500psi, a tensile modulus of 450,000-550,000psi and a lap shear strength exceeding 1,000psi (aluminum to aluminum). Cures to a Shore D hardness of 85-90 with an elongation of 1-3% at 75°F. Is serviceable from -80°F to +350°F, electrically non-conductive (volume resistivity > 1014ohm-cm) and is said to bond well to a variety of substrates, including plastics, glass and metals.

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