Circuits Assembly Online Magazine - News

Latest News

BANNOCKBURN, IL – EMS salary increases reported for 2009 averaged 1.9% for hourly and management employees, and 1.7% for salaried employees, according to IPC’s new 2008-2009 wage and salary report for the North American EMS industry.

In contrast, IPC’s previous EMS salary studies from 2002 through 2007 reported average annual increases in the range of 3% to 3.5%.

The study is based on reports from nearly 130 electronics manufacturing services companies in the US and Canada.

Benefit costs in 2008–2009 climbed to an average of 22.7% of total wages, up from 16.8% in 2007, says IPC. Average work hours remained the same from 2007, at 40 hours per week.

In addition, a declining percentage of companies, approximately 75% percent, are paying 100% of employees’ life insurance premiums.

The study’s findings reflect current economic conditions, IPC said in a press release, noting the recently ended US recession and high unemployment rates.

The report aggregates results from 129 US and Canadian EMS facilities. Mean and median wages, salaries, bonuses and commissions are reported for 31 specific positions.

Companies that participated in the study receive the report free. Other companies may purchase the report at www.ipc.org/ems-wage-salary-report.

AUSTIN – A new research report on 3D through silicon via technology says volume production will prove difficult.

With volume production comes the difficult work of addressing issues of design, thermal management, test, and assembly, TechSearch International says. These issues include installation and qualification of high-volume 300 mm production lines, assembly and test capability, the availability of TSV interposers, and reliability data.

Drivers for the adoption of TSV technology include performance and form factor. However, different needs and economic factors determine the timing of adoption in each application, according to TechSearch, whose founder, Jan Vardaman, is a CIRCUITS ASSEMBLY columnist.

Future 3D TSV applications include DRAM, processors for computing and graphics, FPGAs, as well as processor and memory stacks for wireless products.

The firm highlights in a report the major processes and materials moving into production, including via fabrication methods, via filling, wafer thinning, and bonding methods.

The report provides an update on activities of companies and research organizations. Key barriers to 3D TSV adoption are reviewed with emphasis on design, thermal, and test and assembly issues.

SPOKANE VALLEY, WA -- Key Tronic Corp. today announced revenues rose 8.5% sequentially and fell 4.7% year-over-year for the quarter ended Dec. 26.

FRAMINGHAM, MA – Fourth-quarter worldwide PC microprocessor shipments rose modestly sequentially and set a new record.

SAN JOSE -- Sanmina-SCI last night reported fiscal first-quarter sales of $1.48 billion, up 9% sequentially and 4% year-over-year.

SMYRNA, GA – UP Media Group today announced the addition of three leading suppliers as exhibitors for the third annual Virtual PCB, the industry’s only virtual trade show and conference for the PCB design, fabrication and assembly markets. The two-day worldwide event takes place March 2-4, 2010.

Top electronics design automation suppliers Altium Ltd. and EMA Design Automation have signed on for the event. Also exhibiting is Kyzen Corp., a leading supplier of cleaning products for SMT and semiconductor manufacturing.

A fully interactive, Web-based event, Virtual PCB (www.virtual-pcb.com) incorporates all the critical features of a live event, while allowing PCB design, fabrication and assembly equipment and materials buyers and sellers to interact online. Virtual PCB is supported by a proven software platform (provided by INEXPO), and will be accessible on-demand for two months beyond the two-day live event.

Features of the upcoming virtual event include custom exhibit booths, live attendee-attendee and attendee-exhibitor communication, live and on-demand equipment demonstrations, real-time technical presentations, open “chats” moderated by industry experts, and much more.

“We are thrilled to have these industry leaders as exhibitors,” said UP Media Group president Pete Waddell. “Even more telling, Altium and Kyzen are repeat exhibitors, demonstrating the value and return-on-investment of Virtual PCB.”

For more information about Virtual PCB, visit www.virtual-pcb.com or contact Alyson Skarbek at askarbek@upmediagroup.com.

SAN JOSE – The Semiconductor Industry Association today urged confirmation of Federal Reserve Board Chairman Ben Bernanke to a second term.

“Chairman Bernanke has exercised prudent stewardship during a time of severe economic turmoil,” said SIA president George Scalise, in a statement. “Throughout his tenure at the Fed, Chairman Bernanke has recognized the important role of America’s high-tech industries – and especially of the semiconductor industry – in driving economic growth and enhancing the productivity of American workers.

“Understanding the vital role of technology in the US economy is critical in shaping economic and fiscal policies that promote job growth and attract investment in research and capital-intensive industries. We urge the Senate to confirm Chairman Bernanke’s nomination.”

MUNICH – Siemens today reported its electronics assembly business’ fiscal first-quarter losses narrowed to €14 million from €27 million a year ago.

ELK GROVE VILLAGE, IL – SonoLab, the applications laboratory division of Sonoscan, has recently developed analytical techniques that bring to 25 the number of acoustically detectable features and characteristics used to separate counterfeit plastic IC packages from genuine packages.

HOUSTON – BPM Microsystems announced the retirement of Lyman Brown, executive vice president and chief operating officer, effective Jan. 31.

Founder Bill White will take over as president and CEO. He launched the company in 1985 and ran it until 2003.

Brown began his career with BPM Microsystems in June 2003 as director of business development. He was promoted to executive vice president and COO in November the same year.

MEDWAY, MA – A pair of assembly equipment OEMs have teamed to develop a combination printer-placement line.

Milara and Mirae have developed the P3, a printer and pick-and-place system, which will premiere at Apex in April.

Milara will distribute the line in North and South America, while Mirae will do so in Asia.

No financial terms of the partnership were disclosed.

Milara provides stencil printers for SMT and wafer applications. Mirae manufactures equipment for semiconductor, display and SMT-related applications.

SAN JOSE – North America-based manufacturers of semiconductor equipment posted $863.3 million in orders in December, up 8.3% sequentially, according to SEMI.