ROSEMONT, IL – SMTAI’s keynote presentations here at the end of September will address 3D technology, wearables, and harsh environments.

On Sept. 28, Murad Kurwa of Flextronics will discuss Wearable Technology: The Next Manufacturing Wave. The presentation will address substrate advances like stretchable conductive fabrics, interconnects, new sensor technology, assembly concerns for flexible conductive adhesive and nano-sintering, and encapsulation techniques such as low pressure molding and waterproof coating. R2R printing and assembly, fabric laser cutting, and ultrasonic welding on fabric will be discussed. The presentation will also address reliability testing, washability, salt spray, and sweat testing.

On the same day, Jim Springer, John Deere Electronic Solutions, will present Extreme Environment Electronics - Where We've Been, Where We Are Going and What Could Be Next. He will provide a genesis and the evolution of electronics designed for use in harsh physical and electrical environments, particularly those used in farming and automotive industries. Examples of ruggedization protocols will be discussed.

Rozalia Beica, CTO of Yole Developpement, will present 3D Technology Trends and Manufacturing Challenges on Sept. 29. The presentation will provide an overview of packaging technologies, highlighting miniaturization trends and future roadmaps. Impact of new packaging technologies on assembly needs and rework, highlighting new advancements in materials and equipment, as well as assembly and manufacturing processes needed to address these challenges will be presented.

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