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SAN JOSE -- North American-based manufacturers of semiconductor equipment posted $1.1 billion in orders in October on a three-month average basis. The book-to-bill ratio was 0.95, according to SEMI.

A book-to-bill of 0.95 means that $95 worth of orders were received for every $100 of product billed for the month.

The three-month worldwide bookings average was up 12% over revised September levels and 20% below October 2004.

The three-month average of worldwide billings in October 2005 was $1.16 billion, up 6% from revised September figures but down 19% from last year.

The numbers also include revised August bookings.

"Bookings and billings for North American based semiconductor equipment providers have been stable for the past six months," said Stanley T. Myers, president and CEO of SEMI. "It is encouraging to see the recent improvement in bookings as the industry continues to ramp 300 mm production and is beginning to invest in 65 nanometer technology."

WEST CHICAGO -- Price erosion of surface mount connectors during the past five years has been significant and painful, says Bishop and Associates.

The research firm cites as the main reason the migration of manufacturing to China. "There is no doubt that connector prices have been significantly influenced by the lower costs [of China]. The lower prices are a function of the lower manufacturing costs."

Once the manufacturing migration to China has “run its course” and China prices are fully implemented, connector prices will stabilize, Bishop said. "In effect, the China influence on lower prices is a one-time occurrence. That is, once China pricing is in the marketplace, connector prices stabilize and stop declining. Once the lower costs are passed along, it’s over. There is no more to give the OEMs."

Prices have begun to level, Bishop wrote. "We have already started to achieve connector price stability. Feedback from the industry suggests that the 7-10% price erosion of the past few years has slowed to the historical norm of 3-4% price erosion."

Bermuda-based Tyco International plans to close 16 of its electronics manufacturing factories in North American and Europe and may even spin off some businesses. The conglomerate will take a restructuring charge of up to $175 million, $60 million in fiscal 2006.

SAN JOSE -- "It is extremely unlikely for us to ever do a large acquisition. My view is, most all of them fail." -- Cisco Systems CEO John Chambers, August 2005

"Extremely unlikely" just happened. Cisco agreed Friday to buy Scientific-Atlanta Inc. in a $6.9 billion deal that would create a one-stop shop for sending TV over the Internet.

CHICAGO - Newark InOne provides a complimentary re-reeling service for thousands of surface-mount diodes, transistors and surface-mount ICs and optoelectronic components. Benefiting design engineers and small production manufacturers, this value-added semiconductor service is an extension of the company’s free re-reeling program for surface-mount passive components, launched in late 2004.

For product on cut tape orders longer than 18", Newark InOne automatically applies a leader, trailer and re-spool on each reel according to Electronics Industries Alliance (EIA) standards, which assures that the reel can be properly machine-fed.

For details, visit: newarkinone.com/reels

Hauppauge, NY -- Jaco Electronics, distributor of electronic components, reported increased operating profit and lowered net losses for its fiscal 2006 first quarter, compared to the same quarter last year. During the quarter, Jaco reduced SG&A by 21% year-on-year, which contributed to the operating profit.

ROUND ROCK, TX - In commemoration of America Recycles Day, Dell recognized its employees and partners for helping the company exceed environmental responsibility goals and create new recycling initiatives.

In the past year, Dell exceeded its recycled paper content goal and collected more than 175 tons of unwanted computers around the world. In 2005, the company accelerated efforts to recycle, reuse or resell non-hazardous wastes from manufacturing and other operations.

"Part of being a great global company is being environmentally responsible," said Tod Arbogast, Dell's sustainable business manager. "America Recycles Day provides an opportunity for us to recognize our employees, suppliers and stakeholders who have helped Dell increase usage of recycled paper, offer communities no-cost options for recycling computers and increase the volume of waste material we recycle in our own operations."

Dell’s Forest Products Stewardship Model documents its paper-usage practices and its paper sourcing and recycling goals. One year into the program, Dell has exceeded its initial target by achieving 90% recycled paper content in the company's small and medium business catalog, using Forest Stewardship Council-certified paper sources for the majority of the catalog. Dell increased its use of post-consumer recycled content for catalog inserts to almost 15% and achieved about 30% post-consumer recycled content for office paper.

Dell conducted computer recycling events earlier this year in Bracknell (UK), Munich, Sydney, Winston-Salem (NC), Nashville and Oklahoma City. Dell employee volunteers helped collect more than 175 tons of unwanted computers.

Dell expanded its partnership with Goodwill Industries by establishing an ongoing computer drop-off program for donation and recycling in the San Francisco Bay area and in Michigan.

In the first half of 2005, Dell recycled, reused or resold more than 45,000 tons of cardboard, plastics, pallets, paper and related materials generated in its manufacturing and other operations. The volume of recycled, reused or resold material represents more than 90% of the total nonhazardous waste generated at facilities in the first half of the year, exceeding last year’s 85% recycle/reuse rate.

BANNOCKBURN, IL -- Just months before the RoHS compliance deadline, IPC and JEDEC are seeking papers for their International Conference on Lead-Free Electronic Components and Assemblies. The conference will be held March 6-8, 2006, in Santa Clara, CA.

Papers from environmental managers and technical staff are sought on any relevant subjects, including:
Policy development policy - European lead ban status
European/Chinese/other legislation or voluntary activity on hazardous materials and recycling
Legislative compliance and policy enforcement methods

Supply chain issues
Standards for marking and testing
Materials declarations, part numbers, obsolescence, etc.

Production issues
Design for lead-free production
Components, solder, board developments, availability and lead-free compatibility
Examples of implementation
Reflow, wave, hand soldering, inspection, repair, rework and test, etc.

Reliability issues
Tin whiskers
High reliability product sectors (automotive, aerospace, etc.)
Reliability test data and method developments

Environmental considerations
Toxicity and risk
Recycling
Hazardous substance substitutes
Research consortia news and updates

Submit a 200-300 word abstract, along with a brief biography, to LFConf@ipc.org by Dec.6.

SAN JOSE -- As 2005 draws to a close, it appears the year will have been one of modest growth in the chip industry – despite negative macroeconomic factors such as the price of oil and natural disasters, says market research firm Gartner Inc.

Worldwide semiconductor revenue is forecast to reach $235 billion in 2005, a 6.9% increase from 2004. In 2006, the market is forecast to grow 7.6%, before a mild slowdown in 2007 with growth of 5.1%, according to Gartner.

HARRISBURG, PA -- Tyco Electronics’ Global Application Tooling Division (GATD) has established an Automation Technology Center to develop lead-free PCB assembly technologies and RFID inlay assembly processes and systems. The new center, located in Willow Grove, PA, will be led by George Szekely, general manager.

“Our customers face significant challenges in adapting their manufacturing processes to meet the rapidly approaching RoHS deadlines, and the deployment of RFID technologies bring challenges in inlay manufacturing as well,” said Szekely. “For some time we’ve been focusing on lead-free manufacturing processes, and on RFID inlay assembly processes and systems. This new Technology Center will offer our customers leading-edge equipment solutions, process development and prototype short run services.”

The GATD supplies automated equipment and production tooling used in the manufacturing of electronic assemblies.

HERNDON, VA — The International Electronics Manufacturing Initiative (iNEMI) has released its 2005 Research Priorities, which presents the consensus on R&D needs identified in the 2004 iNEMI Roadmap. The document, intended to help the industry focus on areas critical to future competitiveness, highlights six key challenges the electronics manufacturing industry faces.

ARLINGTON, VA – The monthly order index compiled by the Electronic Components, Assemblies & Materials Association (ECA) began the fourth quarter on an up note, as October numbers continued the strong performance that began in July.

"We're seeing almost the exact opposite of what we witnessed last year at this time," Bob Willis said in a press release. "In 2004, the end of summer marked a downturn; this year, the order index took a big jump in July and the upward momentum has continued."

"CARTS Asia and CARTS Europe [recent ECA events] showed that the industry is in a good place now," says Willis. "Nobody is predicting a boom, but strong worldwide growth is expected, with a few normal regional fluctuations."