HERTFORDSHIRE, UK – Household refrigeration and laundry appliances are on track to ship 326 million units worldwide in 2019, with smart appliances accounting for a growing share of the market, according to Futuresource Consulting.

TAIPEI – Notebook shipments in 2019 are estimated to increase 1.6%, then slip significantly due to the 15% US tariff on Chinese-made notebooks, according to DigiTimes.

HAVERHILL, MA – Lightspeed Manufacturing has moved to a larger facility here to accommodate growth.

SEOUL – Samsung Electronics has developed the industry’s first 12-layer 3D-TSV (through silicon via) technology, according to reports.

HERTFORDSHIRE, UK – Video conferencing hardware shipments increased 50% last year, reaching 1.4 million units, with a projected CAGR of 27% through 2022, according to Futuresource Consulting.

HERTFORDSHIRE, UK – Refined tin use is expected to slip in most sectors this year, as a result of an unstable macroeconomic environment, according to data from the International Tin Association. Refined tin use last year was 372,000 tons, up 2% from 2017.

BLAIRSTOWN, NJ – Thorlabs has completed its acquisition of metrology OEM Operations Technology (Optek) for an undisclosed sum.

SAN JOSE -- Jabil will furlough more than 900 workers at its Silicon Valley plants over the Thanksgiving and Christmas holidays, the company indicated in a state filing last month.

FRAMINGHAM, MA – Worldwide shipments of traditional PCs, comprised of desktops, notebooks, and workstations, reached 70.4 million units in the third quarter, according to preliminary results from market research firm IDC.

FRAMINGHAM, MA – Consumer spending on technology is forecast to reach $1.69 trillion in 2019, an increase of 5.3% over 2018.

COHOES, NY — PVA has acquired the the software and intellectual property of additive manufacturing startup Create Orthotics & Prosthetics.

MILPITAS, CA – A group of trade associations today announced the release of the 2019 Heterogeneous Integration Roadmap outlining the pathway for "pre-competitive" collaboration to advance heterogenous integration technology development and accelerate electronics innovation.