NORTH ANDOVER, MA -- Accent Technologies, a suburban Boston EMS company, has closed its doors.

TORONTO, CANADA -- SMTC will conduct a full physical count of its inventory at the request of its new management following the identification of an overstatement at its EMS operation in Chihuahua, Mexico. SMTC said its financial statements for 2012 and through the first three quarters of 2013 should no longer be relied upon.

SHENZHEN -- Nam Tai today reported fourth-quarter net income of $9.2 million, down 74.7% from a year ago. The company said it will exit the EMS business following the wind down of orders for LCMs at its Shenzhen facility.

TURGI, SWITZERLAND -- Enics has begun administrative procedures as part of a planned layoff of 25 workers here in response to lower industry demand, the EMS company announced. The layoffs will begin in mid February, following completion of the local consultation procedures.

Nepcon Japan is Asia’s largest electronics packaging trade show. The three-day trade show was held Jan. 14-16 at the Tokyo Big Sight convention center. Lighting Japan 2014 and Automotive World 2014 are two other trade shows held concurrently with Nepcon Japan.

SAN JOSE — The 90-day moving average orders at North America-based semiconductor equipment manufacturers rose 48.3% year-over-year in December. Manufacturers reported $1.38 billion in orders worldwide in December, the SEMI trade group announced today.

BANNOCKBURN, IL – Electronics manufacturing services and original design manufacturers worldwide will resume growth in 2014, after a decline of approximately 4.9% percent in 2013, according to a new survey-based report by IPC.

ATLANTA – UP Media Group Inc. today named Robin Foran sales director of CIRCUITS ASSEMBLY, effective immediately.Foran comes to UPMG from Penton Media, where she was a sales executive and sold advertising and exhibition space across the US.

MINNEAPOLIS – The Best of Conference and winner of the 3D track for the International Wafer-Level Packing Conference was Jessica Fredlund, Silex Microsystems. Coauthors of her paper, “Recent Results Using Met-Via TSV Interposer Technology as TMV Element in Wafer Level Through Mold Via Packaging of CMOS Biosensors,” include Toby Ebefors, Silex Microsystems, and Erik Jung and Tanja Braun, Ph.D., Fraunhofer IZM.

TAIPEI -- An investigation into alleged bribe-taking at Foxconn is underway, and the EMS giant says it will cooperate in full. Authorities are looking into the dealings of at least 10 company executives following reports last year that workers in its SMT group had been taking bribes from suppliers.

DUBLIN -- A new study of PCB, material and interconnect trends and needs for electronics assemblies for high-speed applications explores the implications for next-generation architectures and the supply chain as data rates increase.

GARDEN GROVE, CA -- Metcal today announced the schedule for its Advanced Package Rework and Repair seminars during the first half of 2014. The seminars will address the latest techniques to rework and repair a variety of applications.