Alpha OM-550 low temperature solder paste pairs with HRL1 alloy for assemblies with temperature-sensitive substrates, components and high-warpage chips. Reduces soldering temperature required for SAC alloys by 50°C, while reducing power consumption and carbon emissions.

ADS200 production soldering station features TD-200 Cool-Touch hand piece, with aluminum handle designed to stay cool during continuous production soldering.

Master Bond UV22DC80-10F is a single-component, nanosilica-filled thixotropic compound featuring a UV- and heat-curing mechanism.

UULA 3D line confocal scanner enables high-speed 3D imaging of surfaces that are difficult to measure.

ExtremeJet inline cleaner is designed to clean circuit boards at high volumes.

OvenSentinel offers continuous process monitoring down to the in-process zone, board and profile specification level.

SMT 2017 (20.20) inline board cleaner uses patented rollers and a new proprietary adhesive to increase conductivity of the product without adding conductive particles.

R360 forced convection reflow soldering oven features a new airflow concept said to reduce energy consumption, whereby air moves from the fan to the PCB, then through a baffle plate, filter and heat exchanger.

Solder Fortification preforms are generally rectangle- or disk-shaped pieces of alloyed metal that do not contain any flux.

HD-050 telescopic height adjustment table expands working distance with the C-12 and U10 high-performance video microscope inspection systems.

DA 150 series materials die attach adhesives offer conductive and insulating options for a variety of applications.

Kite line scan AOI offers first-article inspection as well as full traceability for faults.