PCAS-1000A stress measurement kit is designed for efficient quality control and quality assurance for PCBs.

HP-520E stencil printer is suitable for any production volume.

SC-CP500-2 pallet cleaner selectable cleaning system comes in five unit sizes, from the single unit device up to a completely automatic cleaning system.

OmniCure AC8-HD (High Dose) series UV LED curing system offers higher optical power and enhanced performance in the same air-cooled mechanical enclosure as its AC8 and AC9 predecessors.

EP42HT-3AO two-component, moderate viscosity epoxy system has good flow properties.

506-03A/B is a two-component 100% solids epoxy encapsulant with a 1:1 volumetric mix ratio.

NS-F851 rosin-based flux for lead-free wave soldering is no-clean and reportedly ensures wetting of all PCB and component substrates for maximum through-hole fill.

SN100CV P608 D4 solder paste is halogen-free, lead-free and no-clean. Unlike silver-containing alloys that derive their strength from a dispersion of fine particles of eutectic Ag3Sn, SN100CV gains its strength from solute atoms in the tin matrix of the joint. Is said to provide excellent wetting and reduce voiding.

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Sigma Line module offers a real-time combination of 3D SPI and 3D AOI measurements.

FH58M FPC connector is 0.25mm pitch.

KY-P3 3D pin inspection now has back-end process AOI capabilities.

Indium8.9HF solder paste is halogen-free, no-clean and has an oxidation barrier said to eliminate head-in-pillow and graping.