High density plus (HD+) card edge power connectors reportedly deliver the highest current density of any card edge power connectors.

Surface Analyst XA evaluates material surfaces to reduce waste, rework, and recalls when poorly prepared substrate surfaces lead to bonding, coating, sealing, painting or printing failure.

Master Bond EP17HTND-CCM is a single-component epoxy that is not premixed and frozen.

Niton XL5 handheld X-ray fluorescence (XRF) analyzer includes three new calibration modes and additional functionality designed to ease screening of products for hazardous materials.

Rotating Brush Nodule for cleaning printed circuit boards comes in MBK modular construction kit and includes a round brush driven at a fixed speed by a DC motor.

Low-void solder columns have high temperature core and are structurally stronger and more reliable than ones with a higher incidence of voids.

LumenX v. 1.6 programmer reportedly delivers better download performance and establishes support for the latest generation of microcontroller (MCU) architectures.

Loctite Eccobond UF 1173 protective underfill material doesn’t contain any reportable REACH SVHCs, is not CMR classified and reportedly performs under high operating temperature environments.

Costimator 2019 cost estimating software supports estimating of hundreds of different manufacturing processes, including all forms of machining, fabrication, assembly, molding, castings, forgings and electronics.

Schroff Conduction Cooled Assembly (CCA) is designed to retain and cool printed circuit boards in environments where convection cooling cannot be used.

PrinTEK Pro MP-1818-V is designed for SMT printing.

Temprobe nondestructive temperature sensing technology is a measurement tool used primarily for high-value assemblies.