Mek's ISO-Spector S3 series of 5-D solder paste inspection systems offers a comprehensive suite of advanced features.

Stackpole's HVCR is a high precision, low VCR chip resistor with high stability.

Würth Elektronik's portfolio of digital isolators now features a two-channel version in a SOIC 8WB package (5.85 x 11.5 x 2.8 mm).

Indium's PicoShot NC-6M is a no-clean, halogen-free, Type 6 powder-size material specifically formulated to be compatible with Mycronic jetting systems and Mycronic’s “small dot” ejector.

Aven’s new diagonal cutters are crafted to provide superior cutting capabilities and longevity, making them ideal for a wide range of industrial tasks.

Master Bond's UV15DC80-1Med is a one-component, no-mix epoxy that offers a dual cure mechanism utilizing UV light for initial fixation followed by heat for complete polymerization.

TopLine's new braided solder columns are designed to serve as a drop-in replacement for solder spheres used in BGA components.

Indium's Durafuse HR solder paste alloy is said to deliver enhanced thermal cycling performance and superior voiding performance without vacuum reflow, especially for high-reliability automotive applications.

Stackpole’s RNWA is a thin film chip resistor with all the benefits of wide terminations and is capable of tolerances to 0.1% and TCR as low as 25ppm.

Dymax's UVCS V3.0 LED conveyor is an enhanced version of the Dymax UVCS conveyor curing systems.

Shenmao's PF918-P250 thermal fatigue-resistant solder paste is designed to meet high-reliability requirements.

ASMPT's Siplace CA2 hybrid placement machine combines semiconductor and SMT production to integrate the production of SiPs (system-in-package modules) directly into the SMT line.